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Rectangular grey thermal pad 120 by 20 by 3.0 millimetres

GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate Thermal Pad 15W 120x20x3.0mm

SKU CH-ECRF-ZVNSR

High-conductivity 15 W/mK thermal pad sized 120 × 20 × 3.0 mm for VRM, memory and SSD gap filling

Option 120 x 20 x 3.0 mm

  • 15 W/mK conductivity moves heat fast from hot components
  • 120×20 mm pad covers VRM, memory and SSD surfaces in one piece
  • 0 mm thickness fills large gaps on uneven boards
  • Non-conductive, non-corrosive, non-curing formula protects electronics
  • Works from -60 °C to 220 °C for extreme environments

High-conductivity thermal pad for dense PCB surfaces

The GP-Ultimate pad delivers 15 W/mK thermal conductivity in a 120×20 mm sheet that is 3.0 mm thick. It targets builders who need to bridge height differences across DRAM ICs, VRM circuits, MOSFETs and M.2 SSDs on graphics cards, laptops or consoles. Non-electrically conductive and non-corrosive, it installs without curing or hardening.

Practical limits of a 15 W/mK pad at 3.0 mm

The 3.0 mm thickness suits larger gaps but reduces conformality on very uneven surfaces compared with thinner 0.5 mm, 1.0 mm, 1.5 mm or 2.0 mm variants. Operating range spans –60 °C to 220 °C, so it remains stable under sustained loads. The fixed 120×20 mm dimensions mean you must cut or buy multiple sheets for larger VRM arrays or full GPU backplates.

Replaces generic gap fillers

Stock thermal pads rated below 15 W/mK often leave VRM or memory temperatures higher than necessary. The jump is worthwhile when thermal throttling appears on high-density boards or when a cooler upgrade demands better contact across stepped components. Builders who need a thinner profile or a different sheet size should select another variant from the same GP-Ultimate range.

Highlights

  • 15 W/mK conductivity moves heat fast from hot components
  • 120×20 mm pad covers VRM, memory and SSD surfaces in one piece
  • 0 mm thickness fills large gaps on uneven boards
  • Non-conductive, non-corrosive, non-curing formula protects electronics
  • Works from -60 °C to 220 °C for extreme environments

Specifications

No published specifications for this item yet.

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Questions about this item

Should I pick the 3.0mm pad or a thinner option like 1.0mm?

Choose the thickness that matches the exact gap between your component and heatsink; the pad is offered in .5, 1.0, 1.5, 2.0 and 3.0mm so you can select the one that fills the space without excessive compression.

What does the 15W/mK conductivity mean when the pad is installed on a GPU VRM?

It indicates the material can move heat across the interface at up to 15 watts per metre-kelvin, helping keep VRM temperatures lower under load compared with lower-conductivity pads.

Does the pad work with the standard mounting pressure used on M.2 SSD heatsinks?

Yes, the non-hardening, non-curing compound conforms to uneven surfaces under typical heatsink clamping force and stays stable from -60°C to 220°C.

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