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GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate 15W/mK Thermal Pad 120x20x0.5mm

SKU CH-2573-8JRXA

High-conductivity 15W/mK thermal pad measuring 120x20x0.5mm for memory, VRM and chipset cooling

Option 120 x 20 x 0.5 mm

  • 15W/mK conductivity transfers heat efficiently from dense components
  • Non-electrically conductive material prevents shorts on exposed PCB areas
  • Soft 0.5mm thickness conforms to uneven VRAM and VRM surfaces
  • 120×20mm sheet covers full-length memory modules in one piece
  • Operating range −60°C to 220°C suits extreme cooling scenarios

GP-Ultimate 15W/mK Thermal Pad

The GP-Ultimate is a 15W/mK thermal pad measuring 120x20mm with a 0.5mm thickness. It provides high thermal conductivity for memory ICs, VRM circuits, M.2 SSDs and other SMD components. The non-electrically conductive, non-corrosive material operates from -60°C to 220°C without hardening.

Suits tight gaps on GPUs and laptops

Builders filling narrow spaces between heatsinks and uneven PCB surfaces will benefit from the thin 0.5mm profile and compliant matrix. It is not intended for larger gaps requiring 1.0mm, 1.5mm, 2.0mm or 3.0mm thicknesses, nor for applications needing electrically conductive interfaces.

Handles dense component arrays

The 120x20mm sheet covers multiple DRAM ICs, MOSFETs or NVRAM chips in a single piece, simplifying installation on crowded boards. The 15W/mK rating delivers strong heat transfer for typical memory and VRM loads, though extreme power densities may exceed its capacity.

Highlights

  • 15W/mK conductivity transfers heat efficiently from dense components
  • Non-electrically conductive material prevents shorts on exposed PCB areas
  • Soft 0.5mm thickness conforms to uneven VRAM and VRM surfaces
  • 120×20mm sheet covers full-length memory modules in one piece
  • Operating range −60°C to 220°C suits extreme cooling scenarios

Specifications

No published specifications for this item yet.

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Questions about this item

My board has uneven VRM and memory heights — will the 0.5 mm thickness still fill those gaps?

The pad is 0.5 mm thick and 120 × 20 mm in size; its soft multilayer matrix compresses to conform to height differences across VRM ICs, DRAM chips and other SMD components.

I plan to reuse an existing heatsink — does the pad’s non-conductive, non-corrosive nature protect that metal over time?

The pad is non-electrically conductive, non-corrosive, non-curing and non-toxic, so it will not degrade or short the heatsink during long-term contact.

After installation, how can I verify the pad is transferring heat within its rated range?

The pad operates from -60 °C to 220 °C; if component temperatures under load stay within that window the interface is performing as specified.

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