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Rectangular grey thermal pad, 120 by 20 by 1.0 millimetres

GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate Thermal Pad 120x20x1.0mm 15W/mK

SKU CH-8Y2K-JD4ZM

High-conductivity 15 W/mK thermal pad measuring 120×20×1.0 mm for VRM, memory and SSD cooling

Option 120 x 20 x 1.0 mm

  • 15W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad protects circuits from short circuits
  • Soft 1.0mm thickness conforms to uneven VRAM and VRM surfaces
  • 120×20mm sheet covers full memory modules or M.2 SSDs
  • Operating range from -60°C to 220°C handles extreme loads

Ultimate thermal conductivity

The GP-Ultimate thermal pad delivers 15 W/mK conductivity in a 120×20 mm sheet that is 1.0 mm thick. It is non-electrically conductive, non-corrosive, non-hardening and non-toxic. The material operates from -60 °C to 220 °C and suits uneven surfaces on VRM ICs, memory modules and M.2 SSDs.

Replaces standard pads

Upgrading from lower-conductivity pads is worthwhile when VRM or memory temperatures limit sustained clocks. The 15 W/mK rating and soft multilayer matrix close gaps on height-variant components better than basic silicone sheets. Choose the 1.0 mm thickness when the factory gap matches this dimension; other thicknesses from 0.5 mm to 3.0 mm exist for different stack heights.

Suits enthusiasts and repairers

Builders who need a single 120×20 mm piece for GPU VRM, laptop DRAM or dense SMD arrays will find the size convenient. Users requiring large continuous sheets for full motherboard coverage or multiple GPU blocks should look at bigger formats. Anyone needing electrically conductive paste or a liquid metal alternative will not be served by this non-conductive pad.

Highlights

  • 15W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad protects circuits from short circuits
  • Soft 1.0mm thickness conforms to uneven VRAM and VRM surfaces
  • 120×20mm sheet covers full memory modules or M.2 SSDs
  • Operating range from -60°C to 220°C handles extreme loads

Specifications

No published specifications for this item yet.

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Questions about this item

What gap thickness does the 1.0 mm pad fill between a VRM and heatsink?

The pad is 1.0 mm thick and compresses to bridge uneven surfaces on VRM ICs, power MOSFETs and similar SMD components.

How do I install the pad without tearing the multilayer matrix?

Peel the protective film, place the 120×20 mm sheet on the component, press evenly so the soft material conforms, then mount the heatsink.

How often should the pad be replaced in a device that cycles between –60 °C and 220 °C?

The pad is non-curing and non-hardening, so it does not degrade from thermal cycling; replace only if the heatsink is removed or the pad is physically damaged.

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