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Two rectangular grey thermal pads 120 by 20 by .5 mm

GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate 15W Thermal Pad 120x20x0.5mm 2pcs

SKU CH-9XWY-2ZGS5

High-conductivity 15 W/mK thermal pad, 120 × 20 × 0.5 mm, non-conductive and non-curing, supplied as two pieces for VRM, memory and SSD cooling

Option 120 x 20 x 0.5 mm

  • 15 W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense boards
  • Soft 0.5 mm thickness fills uneven gaps without excess pressure
  • Supplied as two 120 × 20 mm pieces for VRM, memory or SSD use
  • Stable from −60 °C to 220 °C without hardening or curing

Thermal Pad for Dense PCB Gaps

The GP-Ultimate is a 15 W/mK thermal pad cut to 120×20 mm and supplied as a pair. It targets builders who need to bridge uneven surfaces on memory modules, VRM circuits or M.2 SSDs where paste cannot fill the gap. The material is non-conductive, non-corrosive and non-hardening.

Operating Range and Handling

Rated from -60 °C to 220 °C, the pad stays pliable across extreme internal temperatures without curing or degrading. Its multilayer matrix conforms to height differences on dense SMD layouts, maintaining contact pressure without squeezing out. Installation requires no tools or curing time.

Thickness Match Determines Fit

This variant measures 0.5 mm thick; the same series also exists in 1.0, 1.5, 2.0 and 3.0 mm options. Choosing the wrong height leaves air pockets or stresses the board, so the single specification that decides suitability is the exact gap thickness your component stack requires.

Highlights

  • 15 W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense boards
  • Soft 0.5 mm thickness fills uneven gaps without excess pressure
  • Supplied as two 120 × 20 mm pieces for VRM, memory or SSD use
  • Stable from −60 °C to 220 °C without hardening or curing

Specifications

No published specifications for this item yet.

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Questions about this item

How do I install the 0.5mm pad on a GPU VRM with uneven component heights?

Cut the 120x20mm pad to size, peel the protective film, and press it onto the VRM area so the soft 0.5mm material conforms to height differences across MOSFETs and chokes; the step people miss is removing both liner sides before mating the heatsink.

Will the pad dry out or need replacement after long-term use?

The compound is non-curing and non-hardening across a -60°C to 220°C range, so it stays pliable and does not require scheduled replacement unless the heatsink is removed.

At what point does thermal resistance become the limiting factor during sustained loads?

With 15W/mK conductivity the pad itself rarely bottlenecks; the limit that appears first is the heatsink's ability to dissipate the transferred heat into airflow.

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