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Rectangular grey thermal pad 120 by 20 by 1.5 millimetres

GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate 15W Thermal Pad 120x20x1.5mm

SKU CH-H7Z2-BQFDW

15 W/mK thermal pad sized 120×20×1.5 mm, non-conductive and usable from –60 °C to 220 °C

Option 120 x 20 x 1.5 mm

  • 15 W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense boards
  • Soft 1.5 mm thickness fills gaps on uneven VRAM and VRM surfaces
  • 120×20 mm sheet covers full-length memory modules and M.2 drives
  • Operates from -60 °C to 220 °C without hardening or curing

GP-Ultimate 15W Thermal Pad 1.5mm

The GP-Ultimate thermal pad delivers 15 W/mK conductivity in a 120×20 mm sheet cut to 1.5 mm thickness. It targets builders who need reliable heat transfer across uneven PCB surfaces such as VRM arrays, memory ICs and M.2 SSD controllers. The pad is non-electrically conductive, non-corrosive and non-toxic, making it safe for direct contact with exposed circuitry.

Thermals noise and power

The pad operates continuously from -60 °C to 220 °C without curing, hardening or degrading. Its multilayer matrix conforms to height differences on dense component clusters, maintaining consistent thermal resistance under sustained load. Because it is a passive interface material, it adds no acoustic noise and draws zero power from the system.

Deciding specification

Thermal conductivity of 15 W/mK is the single figure that determines whether this pad meets your design envelope. Lower-conductivity alternatives will not move heat as efficiently across the same gap, while higher-rated pads are not offered in this form factor. If your thermal budget requires a different conductivity value, this product will not satisfy the requirement.

Highlights

  • 15 W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense boards
  • Soft 1.5 mm thickness fills gaps on uneven VRAM and VRM surfaces
  • 120×20 mm sheet covers full-length memory modules and M.2 drives
  • Operates from -60 °C to 220 °C without hardening or curing

Specifications

No published specifications for this item yet.

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Questions about this item

How do I install the 120x20mm GP-Ultimate pad on a GPU VRM, and what step do people often miss?

Cut the 120x20mm sheet to cover each VRM IC, peel both protective films, place the 1.5mm pad flat without stretching, then torque the heatsink evenly; the missed step is removing the second film.

Will the GP-Ultimate 15W/mK pad need replacement, and what signals it's time?

The pad is non-curing and non-hardening, so it does not dry out; replace only if the heatsink is removed or the 1.5mm thickness no longer fills the gap after a board revision.

What thermal limit appears first when the GP-Ultimate pad runs under continuous load?

The pad itself is rated from -60°C to 220°C, so the limiting factor will be the component's maximum junction temperature or the heatsink's dissipation capacity, not the pad.

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