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GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate Thermal Pad 15W/mK 120x20mm 1.0mm 2pcs

SKU CH-WNDP-5NP0S

High-conductivity 15W/mK thermal pad sized 120×20mm and 1.0mm thick, non-conductive and non-curing, supplied as a two-piece pack for VRM, memory and SSD cooling

Option 120 x 20 x 1.0 mm

  • 15W/mK thermal conductivity moves heat fast from dense component clusters
  • Non-electrically conductive formula prevents shorts on exposed PCB traces
  • Soft 1.0mm thickness bridges uneven gaps on VRM and memory ICs
  • 120×20mm sheets cover extended RAM and GPU VRM surfaces in one piece
  • Operates from -60°C to 220°C without curing or corrosion

High-conductivity thermal pad for dense boards

The GP-Ultimate thermal pad delivers 15W/mK conductivity in a 120x20mm sheet at 1.0mm thickness. Two pads are supplied for covering multiple components. The material is non-electrically conductive, non-corrosive, non-hardening and non-toxic. It operates across a -60°C to 220°C range.

Verify component heights and gap before ordering

Measure the distance between each target chip and its heatsink to confirm a 1.0mm pad fills the gap without excessive compression. Ensure the 120x20mm dimensions cover the VRM, memory ICs or M.2 SSD areas you intend to cool. The pad suits uneven surfaces but cannot compensate for larger height differences.

Suits builders cooling VRMs, RAM or M.2 modules

This pad fits enthusiasts addressing hotspots on graphics cards, motherboards or compact SSDs where a 1.0mm thickness matches the stack height. It is not for buyers needing thinner 0.5mm or thicker 1.5mm, 2.0mm or 3.0mm options for different gaps. Users requiring electrically conductive interface material should look elsewhere.

Highlights

  • 15W/mK thermal conductivity moves heat fast from dense component clusters
  • Non-electrically conductive formula prevents shorts on exposed PCB traces
  • Soft 1.0mm thickness bridges uneven gaps on VRM and memory ICs
  • 120×20mm sheets cover extended RAM and GPU VRM surfaces in one piece
  • Operates from -60°C to 220°C without curing or corrosion

Specifications

No published specifications for this item yet.

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Questions about this item

What does the 15 W/mK rating mean when the pad is installed on a GPU VRM or memory module?

The 15 W/mK conductivity efficiently moves heat from VRM ICs, memory ICs and other SMD components to the heatsink across the 1.0 mm thickness, even on uneven surfaces.

Which thickness should I pick — 0.5, 1.0, 1.5, 2.0 or 3.0 mm?

Choose the thickness that matches the gap between your component and the heatsink; this listing supplies the 1.0 mm version in a two-pack.

What comes in the box and do I need any extra material?

Two 120×20 mm pads at 1.0 mm thick are included; no separate thermal compound or adhesive is required.

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