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Square grey thermal pad sheet 120mm by 120mm 3.0mm thick

GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate Thermal Pad 120x120x3.0mm 15W/mK

SKU CH-1T6P-99CH9

A 120×120×3.0 mm thermal pad with 15 W/mK conductivity for GPU VRM, memory ICs and M.2 SSDs, non-conductive and rated –60 °C to 220 °C

Option 120 x 120 x 3.0 mm

  • 15 W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense boards
  • Soft 3.0 mm thickness fills uneven gaps on memory and VRM
  • 120 × 120 mm sheet covers large GPU or RAM areas in one piece
  • Operates from –60 °C to 220 °C without curing or hardening

High-Conductivity Thermal Pad

The GP-Ultimate thermal pad delivers 15W/mK conductivity to bridge uneven surfaces between SMD components and heatsinks. It targets VRM circuits, memory ICs, power MOSFETs and M.2 SSDs where height differences rule out thin paste. The non-electrically conductive, non-corrosive compound stays pliable from -60°C to 220°C without curing or hardening. A single 120×120mm sheet covers enlarged PCB areas in one placement.

Sustained Load Stability

The enhanced multilayer matrix maintains its thermal path during prolonged high-temperature operation without pumping out or drying. Non-curing behaviour means the interface remains consistent across repeated thermal cycles from idle to full load. Non-toxic composition eliminates contamination risk on dense component clusters over the product lifetime. The 3.0mm thickness accommodates larger stack-height variances while preserving full-surface contact.

Paste-to-Pad Upgrade Path

Builders replacing thermal paste on VRM heatsinks, GPU memory banks or M.2 drive controllers gain uniform coverage without air gaps. The jump is worth it when component heights vary across a single heatsink or when rework demands a clean, reusable interface. Thinner 0.5, 1.0, 1.5 and 2.0mm variants exist for tighter clearances, but this 3.0mm option suits the tallest gaps. It does not suit applications needing sub-millimetre bond lines or adhesive mounting.

Highlights

  • 15 W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense boards
  • Soft 3.0 mm thickness fills uneven gaps on memory and VRM
  • 120 × 120 mm sheet covers large GPU or RAM areas in one piece
  • Operates from –60 °C to 220 °C without curing or hardening

Specifications

No published specifications for this item yet.

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Questions about this item

Does the 15 W/mK pad stay soft or harden after months of continuous heat?

It is non-hardening and non-curing, so the material remains compliant across the full -60 °C to 220 °C operating range without stiffening over time.

What surface must I already have clean and ready for the 120×120 mm sheet?

A flat mounting area on the PCB — such as VRM heatsinks, memory modules or M.2 SSD — large enough to accommodate the full 120 mm square.

Will the 3.0 mm thickness bridge the taller VRM components on an older graphics card?

Yes, the 3.0 mm profile is designed for height differences and uneven surfaces like VRM ICs and power MOSFETs on legacy boards.

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