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GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate Thermal Pad 120x120x1.0mm 15W/mK

SKU CH-9N1E-EY2XS

High-conductivity 15 W/mK thermal pad measuring 120×120×1.0 mm for GPUs, VRMs and M.2 SSDs

Option 120 x 120 x 1.0 mm

  • High 15 W/mK conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense PCBs
  • Soft 1.0 mm thickness fills uneven gaps without mechanical stress
  • Wide -60 °C to 220 °C range keeps performance stable in extremes
  • 120 × 120 mm sheet covers large VRAM, VRM or M.2 areas

Thermal pad for uneven PCB surfaces

The Gelid Solutions GP-Ultimate thermal pad measures 120x120mm with a 1.0mm thickness. It is designed to bridge gaps on components with height differences such as VRM circuits, memory ICs and M.2 SSDs. The pad is non-electrically conductive, non-corrosive and non-toxic for safe handling.

15W/mK thermal conductivity rating

This pad delivers a thermal conductivity of 15W/mK through an enhanced multilayer matrix. That single figure determines whether it can move enough heat for your specific VRM or memory cooling requirement. It operates across a wide temperature range from -60°C to 220°C without curing or hardening.

Suits builders fixing hot VRMs or memory modules

This pad suits anyone replacing dried-out factory pads on graphics cards, laptops or motherboards where surface heights vary. It is not for users who need a thin paste for flat CPU dies, nor for builds requiring thicknesses of 0.5mm, 1.5mm, 2.0mm or 3.0mm instead of 1.0mm.

Highlights

  • High 15 W/mK conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense PCBs
  • Soft 1.0 mm thickness fills uneven gaps without mechanical stress
  • Wide -60 °C to 220 °C range keeps performance stable in extremes
  • 120 × 120 mm sheet covers large VRAM, VRM or M.2 areas

Specifications

No published specifications for this item yet.

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Questions about this item

How much heat does the 15 W/mK rating actually move in a real build?

The 15 W/mK conductivity lets the pad transfer heat from VRM or memory chips to a heatsink far more effectively than standard 5–8 W/mK pads, lowering component temperatures under load.

Does the pad’s non-electrically conductive property limit which components it can touch?

Because it is non-electrically conductive, non-corrosive and non-curing, the pad can safely contact exposed PCB traces, VRM MOSFETs, DRAM ICs and M.2 SSD controllers without risk of shorts.

Will the 120×120×1.0 mm sheet fit a laptop GPU VRM array without trimming?

The 120 mm square covers most desktop GPU VRM zones and laptop motherboard sections; the 1.0 mm thickness matches typical VRM-to-heatsink gaps, and the pad can be cut with scissors for smaller layouts.

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