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GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate Thermal Pad 120x120x1.5mm 15W/mK

SKU CH-375E-83KZR

High-conductivity 15 W/mK thermal pad, 120 × 120 × 1.5 mm, non-conductive and non-curing, fills gaps on VRM, memory and SSD components

Option 120 x 120 x 1.5 mm

  • 15 W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense boards
  • Soft 1.5 mm thickness conforms to uneven VRAM and VRM surfaces
  • 120 × 120 mm sheet covers large GPU or memory areas in one piece
  • Operates from -60 °C to 220 °C without hardening or degrading

Thermal Pad for Uneven Components

The GP-Ultimate is a 120×120 mm thermal pad rated at 15 W/mK conductivity. It bridges gaps on PCBs where surface heights vary, such as memory ICs, VRM circuits and M.2 SSDs. The pad is non-electrically conductive, non-corrosive and non-toxic. It operates reliably from -60 °C to 220 °C without hardening.

Builders Needing Gap-Fill on Dense Boards

This pad suits anyone fitting heatsinks to DRAM, MOSFETs or tightly packed SMDs where paste cannot maintain contact. The 1.5 mm thickness handles moderate height differences across a 120 mm square. Buyers who need thinner layers of 0.5 or 1.0 mm, or thicker 2.0 and 3.0 mm options, should choose a different grade. It is not suited for perfectly flat CPU dies where thin paste performs better.

15 W/mK Across a Full 120 mm Sheet

The 15 W/mK rating moves heat efficiently from VRMs, memory modules and SSD controllers to attached heatsinks. A single sheet covers large VRM arrays or multiple RAM sticks without cutting. The 1.5 mm depth compresses to fill uneven stacks but will not bridge very large gaps beyond its thickness. For extreme step heights a thicker pad is required.

Highlights

  • 15 W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive pad prevents short circuits on dense boards
  • Soft 1.5 mm thickness conforms to uneven VRAM and VRM surfaces
  • 120 × 120 mm sheet covers large GPU or memory areas in one piece
  • Operates from -60 °C to 220 °C without hardening or degrading

Specifications

No published specifications for this item yet.

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Questions about this item

What component spacing does the 1.5 mm pad thickness suit?

The 1.5 mm thickness fills gaps on DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other SMD components with that exact height difference.

Will the pad conduct electricity if it touches exposed traces on an older GPU?

No, the pad is non-electrically conductive so it will not short exposed traces on legacy graphics cards.

How can I verify the pad is performing after installation?

Monitor component temperatures under load; they should stay within the pad’s rated operating range of -60 °C to 220 °C.

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