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Square thermal pad 120 by 120 mm 2.0 mm thick

GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate Thermal Pad 120x120x2.0mm 15W/mK

SKU CH-W0WT-KMTPK

High-conductivity 15 W/mK thermal pad measuring 120×120×2.0 mm for GPUs, VRMs and SSDs

Option 120 x 120 x 2.0 mm

  • 15W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive material prevents short circuits on dense PCBs
  • Soft 2.0mm thickness fills uneven gaps on VRAM and VRM modules
  • 120×120mm sheet covers large memory banks and M.2 drives in one piece
  • Operates from -60°C to 220°C for extreme cooling scenarios

High-conductivity thermal pad for PCB components

The GELID SOLUTIONS GP-Ultimate thermal pad measures 120x120mm with a 2.0mm thickness and delivers 15W/mK thermal conductivity. It is designed to fill gaps between uneven surfaces on PCBs such as DRAM ICs, VRM ICs, power MOSFETs, and NVRAM ICs. The pad is non-electrically conductive, non-corrosive, non-hardening, and non-toxic. It supports an operating temperature range from -60°C to 220°C.

Replaces standard pads on high-density boards

This pad upgrades from lower-conductivity materials when heat transfer from densely packed SMD components is critical. The jump is worth it when standard pads cannot conform to height differences across memory modules, GPU VRM circuits, or M.2 SSDs. Its enhanced multilayer matrix ensures seamless application without curing. The 2.0mm thickness suits specific gap tolerances where thinner .5, 1.0, or 1.5mm options are insufficient.

Suits builders addressing VRM and memory thermals

This product suits enthusiasts cooling RAM modules, graphics card VRMs, or M.2 drives where surface irregularities demand a compliant high-conductivity interface. Builders needing thinner profiles should consider the 0.5, 1.0, or 1.5mm variants, while larger gaps may require the 3.0mm option. Those seeking electrically conductive interfaces or adhesive-backed compounds should look elsewhere.

Highlights

  • 15W/mK thermal conductivity moves heat fast from hot components
  • Non-electrically conductive material prevents short circuits on dense PCBs
  • Soft 2.0mm thickness fills uneven gaps on VRAM and VRM modules
  • 120×120mm sheet covers large memory banks and M.2 drives in one piece
  • Operates from -60°C to 220°C for extreme cooling scenarios

Specifications

No published specifications for this item yet.

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Questions about this item

Will the 120×120 mm pad fit my GPU VRM area without trimming?

The pad measures 120×120 mm and 2.0 mm thick; it covers most VRM arrays but you may need to cut it to match the exact component layout.

How do I install the pad without trapping air bubbles?

Clean both surfaces, peel the protective film, lay the pad flat starting at one edge, then press evenly so the soft 15 W/mK material conforms to uneven ICs.

Will the pad dry out or need replacement after a few years?

It is non-curing and non-hardening across an operating range of −60 °C to 220 °C, so it stays compliant and does not require scheduled replacement.

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