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TH-338 soldering kit box with flux paste, solder paste and 10ft desoldering wick braid

TH-338 Soldering Kit Sn99/Ag0.3/Cu0.7 217°C 10ft Wick

SKU CH-61EV-BMDMZ MPN TH-338

Three-in-one kit supplies no-clean flux paste, Sn99/Ag0.3/Cu0.7 solder paste melting at 217°C, and 10 ft of 2.5 mm copper desoldering wick for electronic repair

  • Compatibility/FitmentOut-Opening, Narrow Stile, Store Front Doors
  • Lead-free alloy melts at 217°C for reliable joints
  • No-clean flux removes oxides without leaving residue
  • 10 ft copper wick removes solder quickly and safely
  • Sn99/Ag0.3/Cu0.7 paste ensures strong, bright connections
  • Three essential supplies in one kit for efficient repairs

3-in-1 Soldering Kit for Electronic Repair

The TH-338 kit bundles no-clean flux paste, Sn99/Ag0.3/Cu0.7 lead-free solder paste and 10 ft of 2.5 mm desoldering wick. It suits technicians and hobbyists who need all three consumables for PCB rework, BGA repair or general soldering tasks. The flux removes oxide layers without leaving residue, while the paste melts at 217°C (423°F) for reliable joints.

Compatibility Check Before Ordering

Verify that your components and boards tolerate a 217°C peak temperature during reflow. Confirm the 2.5 mm wick width fits the pads and through-holes you intend to desolder. Ensure your workflow accepts a rosin-based, no-clean flux that leaves minimal residue and meets RoHS requirements. The kit is not for buyers who need a different alloy composition, a lower melting point or a wider braid.

Thermals Noise and Power Draw

The solder paste reaches a stable 217°C melting point with smooth flow and low solder-ball tendency. Flux paste produces low smoke and a non-irritating odor during use. Desoldering wick features anti-static copper braid with high-temperature resistance for fast, clean solder removal. No power supply, fan or active cooling is involved, so acoustic noise and electrical draw are negligible.

Highlights

  • Lead-free alloy melts at 217°C for reliable joints
  • No-clean flux removes oxides without leaving residue
  • 10 ft copper wick removes solder quickly and safely
  • Sn99/Ag0.3/Cu0.7 paste ensures strong, bright connections
  • Three essential supplies in one kit for efficient repairs

Specifications

Compatibility/FitmentOut-Opening, Narrow Stile, Store Front Doors

Questions about this item

Does the TH-338 kit include flux paste, solder paste and desoldering wick, or must any of them be bought separately?

The kit contains one pack of no-clean flux paste, one pack of Sn99/Ag.3/Cu.7 solder paste and one 10 ft roll of 2.5 mm desoldering wick, so nothing extra is required.

Should I choose the Sn99/Ag.3/Cu.7 paste melting at 217 °C or a different alloy for general PCB work?

The supplied paste uses a Sn99/Ag.3/Cu.7 alloy with a 217 °C (423 °F) melting point and 11.2 % flux, formulated for lead-free reflow on PCB, BGA, SMT and SMD tasks.

What does the 217 °C melting point mean when I am actually soldering a joint?

You must heat the joint to at least 217 °C (423 °F) for the Sn99/Ag.3/Cu.7 solder to flow and form a bright, smooth joint; the high-activity flux removes oxides at that temperature.

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