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Spool of 0.8 mm rosin-core solder wire, 50 g net weight

Solder Wire 0.8mm 50g

SKU CH-96A2-H3HE6

Lead-free rosin-core solder wire, 0.8 mm diameter and 50 g net weight, melts quickly for electronic and phone repairs

  • Compatibility/FitmentOut-Opening, Narrow Stile, Store Front Doors
  • Lead-free rosin core avoids irritating fumes during soldering
  • High-purity wire resists oxidation for reliable joints
  • Low melting point speeds up electronic repair work
  • 8 mm diameter suits precision component and phone repairs
  • 50 g reel provides ample length for multiple jobs

Solder Wire 0.8 mm 50 g

This lead-free rosin-core solder wire is suited for electronics repair, phone board work and general electrical soldering. The 0.8 mm diameter provides fine control for small joints and surface-mount components.

Before Ordering Check

Verify that your soldering iron reaches a temperature suitable for lead-free alloys and that the tip size matches the 0.8 mm wire for efficient heat transfer. Ensure your workspace has adequate ventilation despite the low-odour flux.

Build and Daily Use

The spool delivers 50 g of high-purity wire with anti-oxidation properties for consistent flow and low melting point. The rosin core eliminates the need for separate flux application during routine component repairs and prototyping.

Highlights

  • Lead-free rosin core avoids irritating fumes during soldering
  • High-purity wire resists oxidation for reliable joints
  • Low melting point speeds up electronic repair work
  • 8 mm diameter suits precision component and phone repairs
  • 50 g reel provides ample length for multiple jobs

Specifications

Compatibility/FitmentOut-Opening, Narrow Stile, Store Front Doors

Questions about this item

What is included in the package and do I need to buy flux separately?

The package contains one spool of lead-free rosin-core solder wire, 0.8 mm diameter and 50 g net weight. The rosin core provides flux, so separate flux is not required.

Should I choose the 0.8 mm diameter or a different thickness for phone board repairs?

The 0.8 mm diameter suits fine-pitch work such as phone board repairs; thicker wire would be harder to control on small joints.

How does the low melting point affect soldering time on a dense PCB?

The low melting point lets the solder flow quickly, reducing the time the iron contacts the board and lowering the risk of heat damage.

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