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Solder paste syringe, flux bottle and desoldering wick spool

Essmetuin RMA799 Soldering Kit Sn42/Bi58 Paste 30g Flux 10cc Wick

SKU CH-SK3J-X8KCR MPN RMA799

A low-temperature Sn42/Bi58 solder paste with 138 °C melting point, 10 cc no-clean flux and desolder wick for SMD rework on heat-sensitive boards

  • Compatibility/FitmentXG-Sn42Bi57.6Ag0.4, ZB402
  • Low-temp soldering at 138 °C protects heat-sensitive boards
  • Lead-free Sn42/Bi58 paste meets environmental and safety standards
  • No-clean flux leaves minimal residue for faster post-solder cleanup
  • Desolder wick simplifies SMD/SMT component removal
  • Complete kit covers paste, flux and wick for rework tasks

Low-temperature soldering kit

The Essmetuin RMA799 kit bundles Sn42/Bi58 solder paste with a 138 °C melting point, a 10 cc no-clean flux and desoldering wick. It targets technicians who rework SMD and SMT components on heat-sensitive boards such as paper-phenolic or flexible substrates. The low peak temperature reduces the risk of board damage during component removal and replacement. All three consumables are lead-free and halogen-free.

Repair technicians on delicate boards

This kit suits engineers and hobbyists who regularly desolder and replace small parts on low-temperature substrates. The included wick leaves minimal residue, cutting clean-up time after rework. Buyers who need high-temperature alloys for power electronics or automotive modules should look elsewhere, as the Sn42/Bi58 composition is formulated specifically for 138 °C peak profiles.

138 °C melting point alloy

The Sn42/Bi58 paste melts at 138 °C (280.4 °F), a figure that dictates whether the kit matches the thermal budget of the assembly. If the board or components cannot survive standard SAC reflow temperatures, this alloy enables rework without substrate degradation. Verify the 138 °C limit against the board specification before purchasing.

Highlights

  • Low-temp soldering at 138 °C protects heat-sensitive boards
  • Lead-free Sn42/Bi58 paste meets environmental and safety standards
  • No-clean flux leaves minimal residue for faster post-solder cleanup
  • Desolder wick simplifies SMD/SMT component removal
  • Complete kit covers paste, flux and wick for rework tasks

Specifications

Compatibility/FitmentXG-Sn42Bi57.6Ag0.4, ZB402

Questions about this item

What board thickness or temperature limit does the Sn42/Bi58 paste with its 138 °C melting point suit?

The paste melts at 138 °C (280.4 °F) and is intended for paper boards or soft boards that cannot withstand high temperatures, making it suitable for small-component welding on heat-sensitive substrates.

How do I apply the 10 cc no-clean flux and 30 g Sn42/Bi58 paste together for SMD rework, and what step is often missed?

Apply a thin layer of flux to the pads first, then deposit paste; the step often missed is pre-fluxing the pads so the paste wets evenly and the low-temperature alloy flows at 138 °C without bridging.

When will the no-clean desolder wick need replacement during repeated SMD/SMT removal?

Replace the wick once it becomes saturated with solder and no longer draws fresh alloy cleanly; each use leaves only a small residue, so lifespan depends on the volume of joints you desolder.

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