COMPUTERSYSTEMS REPAIR SERVICES DATA REC UPSIREN UX PRO Ultra Thermal Putty 50g 16.8 W/m·K 24 mm

UPSIREN UX PRO Ultra Thermal Putty 50g

This non-conductive thermal putty comes in a 50 g jar and is engineered for water cooling blocks, desktop GPUs and high-power consoles. It bridges millimetre-scale gaps that ordinary paste cannot fill, creating a stable heat path across uneven component clusters such as GDDR6 and GDDR6X memory modules and VRM stages. The material is designed for recurring service work in professional or enthusiast environments.

Check gap thickness and component heights before

The putty is formulated to maintain a uniform 24 mm interface under clamp force, making it suitable for assemblies with wide tolerance stacks around standoffs and frame edges. Verify that your cooling block or heatsink mounting pressure can compress the material to the required thickness without exceeding mechanical limits. Confirm compatibility with your specific GPU or console board layout, as the product targets mixed-height component clusters rather than flat die-only interfaces.

High-viscosity compound resists pumpout under

The hand-mouldable body remains cohesive during prolonged high-temperature operation, preventing the material from migrating away from critical contact zones. Its lightly tacky texture allows precise placement of shaped ribbons or pads using the included sleeves, ensuring even coverage across VRAM and power delivery components. Electrical non-conductivity keeps dense SMD layouts safe while delivering 16.8 W/m·K thermal conductivity for reliable heat transfer.