Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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CS Labs
High-conductivity thermal paste rated above 4,6 W/mK, supplied in a 500 g tub for more than 2500 CPU or GPU applications
CS Labs K4-PRO thermal paste is a high-quality compound developed for computer BGA components including GPUs and CPUs. It is produced in Thessaloniki, Greece as part of a research project supported by Greece and the European Union. The low-viscosity formula covers microscopic gaps between heat sink and component perfectly. Testing follows a comparative method documented in 2014.
This paste suits technicians and enthusiasts who need a non-electrically-conductive compound that withstands temperatures up to 220 Celsius and offers practically infinite operational life. Each application uses less than 0.2g, so the 500g container provides enough material for more than 2500 uses. Buyers who only need a single application or a small syringe will find this quantity excessive.
Thermal conductivity exceeds 4,6 W/mK, which is three times higher than common thermal pastes used in computers and commercial electronics. This single figure determines whether the compound meets the heat-transfer requirement for a given BGA rework or long-lasting cooling application.
| Weight | White Thermal Paste |
|---|
Each application uses less than 0.2 g, so the 500 g container provides enough material for over 2500 separate installations.
Apply a small amount directly onto the component; the paste becomes especially fluid when heated during first use and spreads to fill microscopic gaps between the die and heat sink.
Replace the paste every time the heat sink is removed for cleaning, upgrades or other maintenance; reusing old paste prevents proper contact and leads to overheating.
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