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COMPUTERSYSTEMS REPAIR SERVICES DATA REC

COMPUTERSYSTEMS REPAIR SERVICES DATA REC UPSIREN UX PRO Ultra 20g thermal putty

SKU CH-7CXR-X01CQ

High-viscosity 20 g thermal putty bridges 24 mm gaps with 16.8 W/m·K conductivity for GPU and console VRAM, VRM and controller cooling

Weight 20g

Struck-through versions exist but are not stocked here.

  • Fills 24 mm gaps under cold plates for direct VRAM cooling
  • Hand moldable high viscosity putty resists pumpout during sustained loads
  • 8 W/m·K nonconductive conductivity protects dense SMD layouts
  • 20 g jar sized for one GPU or console service
  • Compatible with RTX 3080 3090 4080 4090 and Radeon 6800 6900 7900

Thermal putty for large-gap cooling

UPSIREN UX PRO Ultra is a 20 g non-conductive thermal putty designed for wide, uneven interfaces up to 24 mm thick. It bridges gaps beneath custom water-cooling cold plates, desktop GPU memory clusters and console heatsinks where standard paste cannot maintain contact. The compound remains electrically safe around dense SMD layouts while delivering 16.8 W/m·K conductivity. It targets builders servicing a single graphics card or game console.

Practical limits of hand-moldable putty

The material is intentionally viscous and only lightly tacky so it can be shaped by hand and held in place under clamp pressure. It resists pump-out and creep during extended high-temperature operation in gaming, mining and AI workloads. Because it is a putty rather than a fluid, it cannot flow into microscopic surface imperfections the way low-viscosity pastes do. Users must form a uniform layer at the required thickness before assembly.

20 g capacity covers one full service

The jar provides enough compound for a typical single service on one desktop GPU or one game console, including full VRAM and VRM coverage at the recommended thickness. Small portions can be decanted for precise placement on memory modules or power stages, then the remainder resealed to preserve texture and cleanliness. The quantity is not suited for multiple large assemblies or repeated disassembly cycles.

Highlights

  • Fills 24 mm gaps under cold plates for direct VRAM cooling
  • Hand moldable high viscosity putty resists pumpout during sustained loads
  • 8 W/m·K nonconductive conductivity protects dense SMD layouts
  • 20 g jar sized for one GPU or console service
  • Compatible with RTX 3080 3090 4080 4090 and Radeon 6800 6900 7900

Specifications

No published specifications for this item yet.

Other versions of this model

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Questions about this item

How do I know the 20 g jar is the right amount for my job?

The 20 g jar is sized for one full GPU or console service including VRAM and VRM coverage at the recommended thickness, with enough left to reseal for later touch-ups.

What does the 16.8 W/m·K conductivity actually deliver inside a graphics card?

It enables efficient heat transfer across GDDR6, GDDR6X and VRM surfaces while staying electrically nonconductive, so the water-cooling loop's potential reaches the components that need it.

Why is the 24 mm gap fill important for a cold plate?

It creates a stable interface around standoffs and mixed-height chips where ordinary paste cannot hold a thermal path, maintaining uniform contact under clamp force.

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