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Grey thermal putty in a 50 g plastic jar with screw lid

COMPUTERSYSTEMS REPAIR SERVICES DATA REC

COMPUTERSYSTEMS REPAIR SERVICES DATA REC UPSIREN UX PRO Ultra 50g 24mm 16.8 W/m·K thermal putty

SKU CH-XG0J-CC0D9

High-viscosity, hand-mouldable thermal putty bridges gaps up to 24 mm on GPU memory, VRM stages and console coolers with 16.8 W/m·K conductivity

Weight 100 g

  • 20g
  • 50 g
  • 100 g

Struck-through versions exist but are not stocked here.

  • Bridges 24 mm gaps on water cooling plates for full component contact
  • Hand moldable high viscosity putty resists pump out under sustained high temperature loads
  • 8 W/m·K non conductive formula safely covers dense GDDR6 and GDDR6X VRAM clusters
  • 50 g jar lets you decant small portions while keeping main supply sealed and fresh
  • Compatible with RTX 3080 3090 4080 4090 and Radeon 6800 6900 7900 boards plus PS5 and Xbox Series X

Workshop-grade thermal putty for wide-gap cooling

UPSIREN UX PRO Ultra is a non-conductive thermal putty rated at 16.8 W/m·K, supplied in a 50 g jar. It targets technicians servicing water-cooling blocks, high-end desktop GPUs and current-generation consoles where ordinary paste cannot bridge the millimetre-scale gaps between cold plates and mixed-height components such as GDDR6 or GDDR6X memory and VRM stages.

Thermals, noise and power draw in normal use

The material maintains a stable 24 mm layer under clamp pressure, creating a uniform heat path that resists pump-out during sustained high-temperature operation. Its high-viscosity, hand-mouldable body stays cohesive without flowing, so the thermal interface remains consistent while the cooling hardware handles the load silently and efficiently.

What the bundled sleeves and jar format change

Included forming sleeves let you shape precise ribbons or pads for exact placement around standoffs and frame edges, reducing mess and improving repeatability. The 50 g capacity suits frequent service work; portions can be decanted for detailed jobs while the main jar stays sealed to preserve texture and cleanliness over multiple repair cycles.

Highlights

  • Bridges 24 mm gaps on water cooling plates for full component contact
  • Hand moldable high viscosity putty resists pump out under sustained high temperature loads
  • 8 W/m·K non conductive formula safely covers dense GDDR6 and GDDR6X VRAM clusters
  • 50 g jar lets you decant small portions while keeping main supply sealed and fresh
  • Compatible with RTX 3080 3090 4080 4090 and Radeon 6800 6900 7900 boards plus PS5 and Xbox Series X

Specifications

No published specifications for this item yet.

Other versions of this model

1 more in the same range

Same family, different memory, cooler or clock — compare before you commit.

Questions about this item

How do I install the UPSIREN UX PRO Ultra thermal putty on a GPU, and what step is often done incorrectly?

Form a ribbon or pad using the included sleeves, place it precisely over the GDDR6/GDDR6X modules and VRM stages, then press the cooler down to create a uniform 24 mm layer; the step people get wrong is skipping the sleeves and applying by hand, which leaves uneven thickness and air pockets.

What maintenance or replacement will this thermal putty need later?

The putty resists pump out during prolonged high temperature operation, so it does not require scheduled replacement; if the cooler is removed for service, simply clean the old material and apply a fresh portion from the sealed 50 g jar.

What is the first limit that appears under sustained heavy loads with this putty?

The thermal conductivity is capped at 16.8 W/m·K, so the bottleneck becomes the putty's own ability to move heat across the 24 mm gap once the GPU or console components reach maximum sustained power.

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