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Grey putty in a 20 g syringe with nozzle

UPSIREN

UPSIREN UX PRO Ultra 16.8 W/mK thermal putty 20g

SKU CH-Y5G3-ZWBXT

High-conductivity 16.8 W/mK thermal putty replaces pads up to 3 mm thick on GPUs and memory, operates from -50 to 200 °C and withstands 250 °C peaks

  • Volume / Net Weight20g
  • Long Term Operating Temperature-50 to 200 C

Weight 20g

  • High thermal conductivity of 16.8 W/m·K for efficient heat transfer
  • Replaces thermal pads up to 3 mm thick with a single putty layer
  • Non‑electrically conductive formula prevents short circuits on sensitive components
  • Stable performance from –50 °C to 200 °C for long‑term reliability
  • 20 g syringe provides enough material for multiple GPU or memory applications

High-conductivity thermal putty for GPU and memory

UPSIREN UX PRO Ultra is a 20 g syringe of sticky thermal compound rated at 16.8 W/m·K. It is formulated to replace soft thermal pads up to 3 mm thick on graphics cards, memory modules and similar components. The material is non-electrically conductive and cures fully without oil bleed. Operating range spans -50 °C to 200 °C with short-term tolerance to 250 °C.

Suited for enthusiasts replacing thick pads

Builders who need a conformable, high-conductivity interface for GPU dies, VRAM or VRM areas will benefit from the putty's tack and compression performance. It is not intended for users who require a traditional low-viscosity paste for thin CPU spreads, nor for applications needing a pre-cut pad with fixed thickness and no manual shaping.

20 g volume covers multiple GPU repastes

The 20 g syringe provides enough material for several graphics-card memory and core applications, including larger dies and surrounding VRAM arrays. Coverage diminishes when filling gaps approaching the 3 mm replacement limit or when coating extensive VRM heatsink arrays across multiple cards.

Highlights

  • High thermal conductivity of 16.8 W/m·K for efficient heat transfer
  • Replaces thermal pads up to 3 mm thick with a single putty layer
  • Non‑electrically conductive formula prevents short circuits on sensitive components
  • Stable performance from –50 °C to 200 °C for long‑term reliability
  • 20 g syringe provides enough material for multiple GPU or memory applications

Specifications

Volume / Net Weight20g
Long Term Operating Temperature-50 to 200 C

Other versions of this model

2 more in the same range

Same family, different memory, cooler or clock — compare before you commit.

Questions about this item

What graphics card or memory module must I already have for this 20 g putty to replace a pad up to 3 mm thick?

Any GPU or memory chip that currently uses a soft thermal pad up to 3 mm thick can be serviced with this putty; the 20 g syringe covers multiple such components.

Will the 16.8 W/m·K conductivity still help if I keep an older heatsink that previously used standard pads?

Yes, the putty’s conductivity is at least three times higher than typical pads, so it improves heat transfer even with an older heatsink.

How can I confirm the putty is performing correctly after I apply it to the GPU die?

Monitor GPU core and memory temperatures under load; they should stay within the -50 °C to 200 °C operating range and show lower peaks than with the previous pad.

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