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Small tub of grey thermal putty, 20 g net weight

UPSIREN

UPSIREN UX PRO Ultra 16.8 W/mK Thermal Putty 20 g

SKU CH-FF95-EJ70M

High-conductivity thermal putty replaces pads up to 3 mm thick on GPUs and memory with 16.8 W/m·K performance

  • Volume / Net Weight20g
  • Long Term Operating Temperature-50 to 200 C

Weight 200g

  • High thermal conductivity rated at 16.8 W/m·K for rapid GPU cooling
  • Replaces thermal pads up to 3 mm thick with a single putty application
  • Non-conductive formula eliminates short-circuit risk on sensitive memory chips
  • Operates reliably from -50 °C to 200 °C for long-term stability
  • Supplied in a 20 g syringe for precise, mess-free dispensing

UPSIREN UX PRO Ultra 16.8 W/mK Thermal Putty

UPSIREN UX PRO Ultra is a high-conductivity thermal putty supplied in a 20 g container. It is designed for graphics-card memory chips, GPU dies and similar components where a soft, gap-filling material is required. The compound replaces thermal pads up to 3 mm thick and remains stable across a long-term operating range of -50 to 200 °C. No electrical conductivity is present, so accidental bridging of adjacent circuitry is avoided.

Builders replacing dried pads on GPU memory

Enthusiasts servicing graphics cards, laptop heatsinks or small-form-factor boards will find the putty easy to press into uneven gaps without cutting pads to size. The material cures fully with no oil bleed and suits automated dispensing if preferred. Users who need a traditional thin-layer paste for a bare CPU die, or who require a specific pad thickness for structural spacing, should look at alternative products.

16.8 W/mK thermal conductivity

The headline figure of 16.8 W/mK is at least three times higher than common thermal pads used in consumer electronics. This conductivity value is the primary metric that determines whether the putty can move enough heat for a given GPU or memory application.

Highlights

  • High thermal conductivity rated at 16.8 W/m·K for rapid GPU cooling
  • Replaces thermal pads up to 3 mm thick with a single putty application
  • Non-conductive formula eliminates short-circuit risk on sensitive memory chips
  • Operates reliably from -50 °C to 200 °C for long-term stability
  • Supplied in a 20 g syringe for precise, mess-free dispensing

Specifications

Volume / Net Weight20g
Long Term Operating Temperature-50 to 200 C

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Questions about this item

How does the 16.8 W/mK conductivity translate when the putty is actually on a GPU or memory chip?

The putty delivers at least three times the thermal conductivity of standard pads, so heat moves from the die to the heatsink far more efficiently once it is compressed in place.

What does the non-electrically-conductive specification mean for installation around exposed circuitry?

Because the material carries no electrical conductivity, it can be applied directly over components and traces without risk of shorting adjacent pins or pads.

What physical gap can the 20 g syringe fill when replacing pads up to 3 mm thick?

The putty conforms to uneven surfaces and can bridge gaps up to 3 mm, eliminating the need to match precise pad thicknesses for each component.

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