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UPSIREN

UPSIREN UTP-8 Thermal Putty 10 g 14.8 W/mK

SKU CH-9A9J-WZP83

High-performance thermal putty with 14.8 W/mK conductivity, 10 g volume, and non-conductive formula for GPU and IC gap filling

  • Volume / Net Weight10g
  • Thermal Conductivity14.8W/mk
  • Long Term Operating Temperature-55 to 200 C
  • Featuresnon-conducting

Weight 10g

  • High thermal conductivity of 14.8 W/mK for efficient heat transfer
  • Operates reliably from -55 °C to 200 °C
  • Non-conductive formula prevents electrical short circuits
  • Fully cured putty never dries out for lasting performance
  • Fills gaps completely unlike thermal pads for better contact

High-conductivity thermal putty

UPSIREN UTP-8 is a 14.8 W/mK thermal compound supplied in a 10 g syringe. It is designed for GPU memory modules, VRM components and similar ICs where a putty consistency fills uneven gaps more effectively than standard grease. The material is non-conducting and fully cured, so it will not dry out or pump out over time.

Gap-filling alternative to pads

The low-viscosity putty conforms to irregular surfaces and varying stack heights without the cutting or stacking required for thermal pads. It adheres well to heatsinks and suits automated dispensing or stencil printing workflows. Because it is not a silicone grease, it must not be applied to a CPU die or heatspreader.

Stable across extreme temperatures

Rated for continuous operation from -55 °C to 200 °C, the compound maintains its thermal path in harsh environments. RoHS compliance and halogen-free construction meet restricted-substance requirements. The 10 g volume covers multiple GPU or VRM rework jobs but is not intended for large-area CPU applications.

Highlights

  • High thermal conductivity of 14.8 W/mK for efficient heat transfer
  • Operates reliably from -55 °C to 200 °C
  • Non-conductive formula prevents electrical short circuits
  • Fully cured putty never dries out for lasting performance
  • Fills gaps completely unlike thermal pads for better contact

Specifications

BrandUPSIREN
SeriesUTP-8
ModelUTP-8 10G
Volume / Net Weight10g
Thermal Conductivity14.8W/mk
Long Term Operating Temperature-55 to 200 C
Featuresnon-conducting

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Questions about this item

At what temperature does UTP-8 thermal putty reach its upper operating limit?

The putty is rated for continuous use up to 200 °C, so it remains stable even under heavy GPU or VRM loads.

How much heat does the 14.8 W/mK putty dissipate during all-day operation without drying out?

Its fully cured formula stays tacky and non-conductive, transferring heat steadily at 14.8 W/mK without pumping out or hardening over time.

Which components must already be in place for UTP-8 to work as a thermal pad replacement?

You need a heatsink or cold plate ready to mount, because the putty fills gaps between the die and that surface — it cannot be used as silicone grease on a CPU.

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