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Grey thermal putty in a 20 g syringe, non-conductive paste for GPU and IC gap filling

UPSIREN

UPSIREN UTP-8 20g Thermal Putty 14.8W/mk

SKU CH-RH9H-Q5KM2

High-conductivity 14.8 W/mK thermal putty for GPU and IC gap filling, non-conductive and stable from -55 °C to 200 °C

  • Volume / Net Weight20g
  • Thermal Conductivity14.8W/mk
  • Long Term Operating Temperature-55 to 200 C
  • Featuresnon-conducting

Weight 20g

  • High thermal conductivity of 14.8 W/m·K for efficient heat transfer
  • Non-conductive formula prevents electrical shorts on sensitive components
  • Operates reliably from -55 °C to 200 °C for extreme environments
  • 20 g syringe provides enough material for multiple GPU or IC applications
  • Fully cured putty eliminates dry-out and fills gaps better than thermal pads

UPSIREN UTP-8 20g Thermal Putty

UPSIREN UTP-8 is a 20g thermal putty with 14.8W/mk conductivity designed for GPU memory modules, VRM components, and similar IC packages. It replaces conventional thermal pads by flowing into uneven gaps for complete contact. The non-conductive formula eliminates short-circuit risk on dense circuit boards. It suits repair technicians and enthusiasts reworking graphics cards or similar assemblies.

Check component height

Verify the clearance between your target component and the heatsink exceeds the putty compression range. This material cannot substitute CPU thermal paste due to different viscosity and mounting pressure requirements. Ensure the application area tolerates a tacky, non-curing compound that remains pliable. Confirm operating temperatures stay within the -55 to 200 C rating for long-term stability.

Non-curing putty with stencil-printing suitability

The fully cured compound never dries out, maintaining consistent thermal transfer without pump-out or degradation over time. Low viscosity allows automated dispensing or manual stencil-screen application for repeatable coverage. Tacky texture holds position on vertical heatsink surfaces during assembly. RoHS compliant and halogen-free construction meets restricted-substance regulations for professional repair environments.

Highlights

  • High thermal conductivity of 14.8 W/m·K for efficient heat transfer
  • Non-conductive formula prevents electrical shorts on sensitive components
  • Operates reliably from -55 °C to 200 °C for extreme environments
  • 20 g syringe provides enough material for multiple GPU or IC applications
  • Fully cured putty eliminates dry-out and fills gaps better than thermal pads

Specifications

BrandUPSIREN
SeriesUTP-8
ModelUTP-8 20G
Volume / Net Weight20g
Thermal Conductivity14.8W/mk
Long Term Operating Temperature-55 to 200 C
Featuresnon-conducting

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Questions about this item

What comes in the package and is any extra tool needed to apply the 20 g putty?

The package contains 20 g of UTP-8 thermal putty. No separate tool is required; the low-viscosity material can be dispensed directly or applied with a stencil or screen-printing equipment.

Which version should I choose if I need a non-conductive compound for GPU or IC rework?

UTP-8 is the only version listed; it is non-conducting, rated at 14.8 W/mk, and designed for VGA GPU, IC processor and similar rework or field-repair tasks.

What does the 14.8 W/mk rating mean for real-world GPU cooling?

It indicates high thermal conductivity that fully fills gaps under compression, stays tacky on the heatsink, and operates continuously from -55 °C to 200 °C without drying out.

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