UPSIREN
UPSIREN U6 PRO Thermal Putty 200 g
High-performance, non-drying thermal putty fully fills gaps for GPU, memory and automotive electronics while staying tacky and RoHS compliant
- High thermal conductivity for efficient heat transfer
- Fully cured formula that never dries out
- Natural tackiness ensures low contact resistance
- Halogen-free and RoHS compliant for safety
- 200 g tub covers multiple rework applications
Thermal Putty for GPU and IC Rework
UPSIREN U6 PRO is a 200 g tub of fully cured thermal putty designed for graphics cards, memory modules and other integrated circuits. It replaces traditional thermal pads by flowing into uneven gaps and maintaining consistent contact pressure. The material is RoHS compliant and halogen free for regulated environments. It is not intended for CPU applications.
Gap-Filling and Automation Benefits
The putty’s low viscosity allows dispensing by hand, stencil screen printing or auto dispensing equipment. It fully fills microscopic voids between die and heatsink, eliminating the air pockets that limit pad performance. Natural tackiness holds components in place during assembly without adhesives. Because the compound is fully cured it does not dry out or bleed oil over time.
High Compression Headroom for Stacked Assemblies
High compressibility lets the material absorb tolerance stack up in multi chip modules, laptop GPU blocks and automotive control units. It sustains thermal transfer through repeated thermal cycles in power supplies, telecom gear and military electronics. The 200 g volume covers multiple rework jobs but is not suited for large area CPU heat spreaders. Buyers needing a CPU paste or a pre cut pad for a specific socket should look elsewhere.
Highlights
- High thermal conductivity for efficient heat transfer
- Fully cured formula that never dries out
- Natural tackiness ensures low contact resistance
- Halogen-free and RoHS compliant for safety
- 200 g tub covers multiple rework applications
Specifications
No published specifications for this item yet.
Other versions of this model
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Questions about this item
Does the 200 g putty dry out or need replacing after a period of use?
The material is fully cured and does not dry out, so it does not require scheduled replacement under normal conditions.
What limits continuous use — pump-out, oil bleed, or thermal resistance rise?
It is formulated with no oil-bleeding and high compression stability, preventing pump-out and keeping contact resistance low during sustained operation.
How much heat does the putty itself generate during all-day operation?
The putty is a passive thermal interface; it adds no heat of its own and simply conducts heat away from the component to the heatsink.
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