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TYAN

TYAN B7129F83AV8E4HR-N barebone server 4U 10 DW GPU 32 DDR4 12 bay 4800W

SKU CH-R7PV-BFQ4K MPN B7129F83AV8E4HR-N

4U rackmount barebone supports up to 10 double-wide GPUs, 32 DDR4-3200 DIMM slots for 8 TB, and 12 hot-swap drive bays with four NVMe ports

  • Form Factor4U Rackmount
  • WorkloadAI/ML/HPC
  • CPU Type3rd Gen. Intel Xeon Scalable Processor
  • CPU SocketLGA 4189
  • Installed CPUNo CPU Installed
  • Max Processors2
  • Supports up to 10 double-wide GPU cards for dense AI workloads
  • 32 DDR4-3200 slots enable up to 8 TB of ECC memory
  • Dual 3rd Gen Xeon Scalable CPUs with 270 W TDP each
  • 12 hot-swap drive bays including four NVMe U.2 ports
  • Redundant 4800 W power supply keeps the system running

AI/ML/HPC barebone server

The TYAN B7129F83AV8E4HR-N is a 4U rackmount barebone server built for AI, machine learning and high-performance computing workloads. It targets system integrators and data-centre teams who need a dual-socket Intel Xeon platform with massive GPU density and flexible storage options. No CPUs, memory or drives are installed, allowing full customisation for specific compute requirements.

Thermals, noise and power

The chassis operates between 10 °C and 35 °C and survives non-operating temperatures from -40 °C to 70 °C. A redundant 4800 W power supply delivers the headroom needed for dual 270 W TDP processors and up to ten double-wide GPU cards. High-density component packing and redundant cooling mean audible fan noise is significant, as expected in a 4U GPU-dense rackmount environment.

GPU topology constraint

The single specification that decides fit is the ability to host ten double-wide GPUs with even CPU attachment or single-root topology via BIOS setting. This is enabled by dual PLX PEX88096 PCIe switches and the C621A chipset on a dual LGA 4189 platform. Buyers who need fewer than ten GPUs or a different interconnect topology should evaluate alternative chassis.

Highlights

  • Supports up to 10 double-wide GPU cards for dense AI workloads
  • 32 DDR4-3200 slots enable up to 8 TB of ECC memory
  • Dual 3rd Gen Xeon Scalable CPUs with 270 W TDP each
  • 12 hot-swap drive bays including four NVMe U.2 ports
  • Redundant 4800 W power supply keeps the system running

Specifications

BrandTYAN
ModelB7129F83AV8E4HR-N
Form Factor4U Rackmount
WorkloadAI/ML/HPC
CPU Type3rd Gen. Intel Xeon Scalable Processor
CPU SocketLGA 4189
Installed CPUNo CPU Installed
Max Processors2
CPU FeaturesMax up to 270W (TDP)
North BridgeIntel C621A
Memory Slots32 x 288Pin
Installed Memory SizeNo Memory Installed
Max Memory Supported8TB
Memory Type SupportedDDR4 3200
Channel Supported8 Channel
ECC SupportedYes
Installed HDDNo Storage Installed
SATA RAIDRAID 0/1/10/5 (Intel RSTe)
M.2(1) 2280 (by PCIe 3.0 x4) M.2 slot on MB / (1) 2280 (by PCIe 4.0 x1) M.2 slot on PCIe I/O board
(2) SFF-8654 for (4) NVMe ports
GPU/VPUAll GPU connected to CPUs evenly
First LANRealtek RTL8211E
Max. LAN Speed1 Gigabit
Hot-Swap Bays(12) 3.5"/2.5" Hot-Swap HDD/SSDs w/ (4) NVMe
Front USB2 x USB 3.0
COM1
VGA1
Rear USB2 x USB 3.0
RJ451
TemperatureOperating Temp.: 10°C ~ 35°C (50°F~ 95°F)
Non-operating Temp.: -40°C ~ 70°C (-40°F ~ 158°F)
Humidity90%, non-condensing at 35°C
Dimensions6.9" x 17.26" x 32.68"
Weight101.4 lbs.
Shipping weight48.99 kg
Package size1143 × 635 × 432 mm

Questions about this item

How do I install the CPUs into the LGA 4189 sockets, and what step do people often miss?

Align each processor with the socket notches, lower the load plate, and torque the four captive screws in a cross pattern to the specified value; the step most often missed is applying the correct torque sequence so the CPU seats evenly across all 4189 contacts.

What maintenance or replacement will the 4800W redundant power supply need later?

The hot-swap power modules can be replaced individually without shutting down the server; plan to swap a module if its status LED shows a fault or after the manufacturer's rated service hours.

What is the first limit reached when all 10 double-wide GPUs run sustained workloads?

The operating temperature ceiling of 35 °C is typically the first constraint; inlet air above that threshold will trigger thermal throttling before power or memory bandwidth saturates.

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