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2U silver rack server with 24 front E3.S drive bays

Supermicro

Supermicro SSG-222B-NE3X24R 24-bay E3.S barebone server

SKU CH-XNDZ-X7GEN MPN SSG-222B-NE3X24R

2U barebone server holds 24 front-loading E3.S NVMe drives with dual Xeon 6700 processors and PCIe 5.0 expansion

  • 24 front hot-swap E3.S NVMe bays for high-density all-flash storage
  • Dual Socket E2 (LGA-4710) Intel Xeon 6700 series processors deliver scalable compute
  • Up to 32 DDR5-6400 DIMM slots support 8 TB memory capacity
  • PCIe 5.0 and CXL 2.0 expansion slots enable high-speed connectivity
  • Air cooling supports CPU TDP up to 350 W for sustained performance

24-bay E3.S storage server

The Supermicro SSG-222B-NE3X24R is a 2U barebone server built for high-density NVMe storage. It supports up to 24 front-loading E3.S 1T drive bays and dual Intel Xeon 6700 series processors in LGA-4710 sockets. The platform targets workloads that demand large flash capacity and PCIe 5.0 throughput in a compact rack form factor.

Air cooling for 350W CPUs

Each processor socket is rated for up to 350W TDP with air cooling, allowing the system to sustain high compute density without liquid infrastructure. The chassis accommodates up to two double-width GPUs with a maximum 300W TDP each. Power delivery and thermal design are engineered for continuous operation under heavy storage and acceleration workloads.

32 DDR5 slots and CXL 2.0 expansion

The system provides 32 DIMM slots for DDR5-6400 memory up to 8TB in a 2DPC configuration. Two OCP 3.0 AIOM slots and multiple PCIe 5.0 x16 and x8 slots enable flexible networking and accelerator choices. Up to 8 CXL 2.0 x8 Type 3 devices can be attached for memory expansion or coherent acceleration. Builders needing more than 24 drive bays or single-socket operation should consider other platforms.

Highlights

  • 24 front hot-swap E3.S NVMe bays for high-density all-flash storage
  • Dual Socket E2 (LGA-4710) Intel Xeon 6700 series processors deliver scalable compute
  • Up to 32 DDR5-6400 DIMM slots support 8 TB memory capacity
  • PCIe 5.0 and CXL 2.0 expansion slots enable high-speed connectivity
  • Air cooling supports CPU TDP up to 350 W for sustained performance

Specifications

No published specifications for this item yet.

Questions about this item

How do I install the 24 E3.S NVMe drives into the front-loading bays and which step is commonly missed?

Slide each E3.S 1T NVMe drive into a front hot-swap bay until the latch clicks; the step often missed is fully seating the latch to engage the PCIe 5.0 connector and lock the drive in place.

What maintenance or replacement will the dual Xeon 6700 series processors and memory configuration require over time?

The LGA-4710 sockets and 32 DDR5-6400 DIMM slots are fixed; plan for fan and power-supply module replacements as the primary field-serviceable items.

What thermal limit appears first when the CPUs run at 350 W TDP continuously under air cooling?

The 350 W per-socket ceiling with air cooling is the first sustained-use boundary; exceeding it requires liquid cooling not included in this barebone.

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