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Supermicro 1U passive CPU heat sink for LGA 3647 socket

Supermicro

Supermicro SNK-P0067PSMB 1U LGA 3647 CPU Heat Sink server accessory

SKU CH-4KZD-H51HM MPN SNK-P0067PSMB

Passive 1U CPU heat sink for Xeon Scalable processors using the LGA 3647-0 narrow mounting mechanism

  • Designed for 1U server density
  • Passive middle-air-channel cooling architecture
  • Fits Intel Xeon Scalable processors
  • Narrow LGA 3647-0 socket mounting
  • Supermicro certified compatibility

LGA 3647-0 server CPU heat sink

This Supermicro SNK-P0067PSMB is a new 1U passive proprietary middle-air-channel heat sink built for Intel Xeon Scalable processors using the narrow LGA 3647-0 mounting mechanism. It is designed for system integrators and IT teams deploying or maintaining Supermicro X11 Purley platform servers in rack environments.

Capacity and headroom

The cooler fits a single 1U chassis slot and relies on forced chassis airflow through its middle air channel to dissipate heat from supported CPUs. It handles thermal loads typical of compatible Xeon Scalable parts within the platform specification; higher-TDP processors or enclosures with restricted airflow will exceed its passive cooling capability.

What the Supermicro certification changes

Supermicro certification confirms the heat sink meets the vendor’s mechanical and thermal validation for the X11 Purley platform, ensuring correct mounting pressure and alignment with the narrow socket retention system. Using a non-certified alternative risks improper contact, clearance conflicts or insufficient cooling under sustained server workloads.

Highlights

  • Designed for 1U server density
  • Passive middle-air-channel cooling architecture
  • Fits Intel Xeon Scalable processors
  • Narrow LGA 3647-0 socket mounting
  • Supermicro certified compatibility

Specifications

No published specifications for this item yet.

Questions about this item

Will this heat sink fit the LGA 3647 socket on my existing Supermicro X11 Purley platform motherboard?

Yes, it is designed for the LGA 3647-0 narrow mounting mechanism used on Supermicro X11 Purley platform boards.

How can I confirm the heat sink is seated correctly after installation?

Verify the mounting mechanism locks firmly onto the socket retention frame and that the middle air channel aligns with the processor surface.

Does the package include thermal paste or a mounting backplate for the LGA 3647 socket?

The accessory is the passive 1U heat sink only; thermal interface material and any required backplate are supplied separately.

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