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Silver rectangular 1U CPU heat sink with fin array

Supermicro

Supermicro SNK-P0067PS LGA 3647-0 1U CPU Heat Sink

SKU CH-47W1-NXM2Z MPN SNK-P0067PS

Passive 1U heat sink for LGA 3647-0 sockets on Purley platforms

  • Fits Intel LGA 3647-0 sockets for secure installation
  • 1U low-profile design enables dense rack deployment
  • Purley platform compatibility simplifies server integration
  • Passive cooling reduces failure points in critical systems

LGA 3647-0 1U Server Heat Sink

This Supermicro accessory fits LGA 3647-0 sockets on the X11 Purley platform. It is built for 1U rackmount chassis where vertical space is limited. System integrators configuring dense compute nodes will find it matches the platform requirements.

1U Form Factor for Rack Builds

The low-profile design sits inside a single rack unit without blocking adjacent slots or cabling. It attaches directly to the socket mounting points supplied with the motherboard. No separate fan assembly or liquid loop is required, leaving the remaining internal volume free for memory and storage expansion.

Highlights

  • Fits Intel LGA 3647-0 sockets for secure installation
  • 1U low-profile design enables dense rack deployment
  • Purley platform compatibility simplifies server integration
  • Passive cooling reduces failure points in critical systems

Specifications

No published specifications for this item yet.

Questions about this item

How does the 1U height restrict sustained thermal headroom?

The 1U form factor limits fin stack height, so thermal capacity is constrained by the thin profile.

What noise and heat levels should I expect during all-day operation?

Passive design means zero fan noise; heat output matches the CPU TDP the sink is rated for.

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