Supermicro
Supermicro SNK-P0063P 2U Passive CPU Heat Sink Socket SP3 EPYC 7000 7002 Series
Passive 2U CPU heat sink for AMD EPYC 7000 and 7002 series processors in Socket SP3 servers
- TypeCPU Heat Sink Socket
- Features2U Passive CPU Heat Sink AMD EPYC 7000 and 7002 Series Proce
- Passive 2U design cools EPYC 7000 and 7002 CPUs silently
- Fits Socket SP3 OLGA4094 server boards without active airflow
- RoHS and REACH certified for environmentally responsible operation
- Supermicro SNK-P0063P validated for 1U and 2U rack chassis
- One-year limited warranty backs the heat-sink reliability
Compatible Socket SP3 Heat Sink
The Supermicro SNK-P0063P is a passive CPU heat sink designed for AMD EPYC 7000 and 7002 series processors using the Socket SP3 interface. It fits 2U server chassis and targets system builders assembling or maintaining compatible enterprise platforms. The unit carries RoHS and REACH environmental certifications. It is not suited for builds requiring active cooling or processors outside the stated EPYC families.
Passive 2U Installation Notes
Installation follows standard SP3 mounting procedures for passive heat sinks in a 2U form factor. Correct torque sequence and thermal interface material application are critical to avoid uneven contact on the large socket surface. Common issues include insufficient clamping pressure leading to thermal throttling and physical interference with nearby motherboard components in dense layouts. The passive design eliminates fan failure risk but demands adequate chassis airflow.
Sustained Load Thermal Behaviour
Under continuous workloads the aluminium fin stack relies entirely on forced airflow from chassis fans to dissipate heat. Thermal resistance remains stable as long as inlet air temperature and flow rate meet the platform specifications for the installed EPYC processor. Performance degrades if case ventilation is restricted or if adjacent components exhaust hot air into the heat sink intake. The 1 year limited warranty covers manufacturing defects only.
Highlights
- Passive 2U design cools EPYC 7000 and 7002 CPUs silently
- Fits Socket SP3 OLGA4094 server boards without active airflow
- RoHS and REACH certified for environmentally responsible operation
- Supermicro SNK-P0063P validated for 1U and 2U rack chassis
- One-year limited warranty backs the heat-sink reliability
Specifications
| Brand | SUPERMICRO |
|---|---|
| Model | SNK-P0063P |
| Type | CPU Heat Sink Socket |
| Features | 2U Passive CPU Heat Sink AMD EPYC 7000 and 7002 Series Processors Socket OLGA4094 (Socket SP3) |
| Shipping weight | 0.54 kg |
| Package size | 142 × 116 × 107 mm |
Questions about this item
How do I verify the heat sink is seated correctly on the Socket SP3 after installation?
The heat sink should make firm, even contact with the EPYC 7000 or 7002 series processor once the retention mechanism is secured; CPU temperatures under load will confirm proper thermal transfer.
Does the package include thermal paste or mounting brackets, or must they be purchased separately?
The SNK-P0063P is supplied as the passive heat sink only; thermal interface material and any SP3-specific mounting hardware are not included and must be sourced separately.
Which version of this heat sink matches my EPYC 7002 series processor in a 2U chassis?
The SNK-P0063P is the 2U passive model validated for Socket SP3 (OLGA4094) and supports both EPYC 7000 and 7002 series CPUs.
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