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Green rectangular processor with gold contacts and a silver heat spreader, labelled Xeon X5675

HPE

HPE 625073-B21 Xeon X5675 3.06 GHz 6-core server accessory

SKU CH-YASP-TD7ZR MPN 625073-B21

A refurbished six-core Xeon processor upgrade running at 3.06 GHz with 12 MB L3 cache for compatible HPE servers

  • TypeInterface Processor
  • ColorGreen
  • Six cores at 3.06 GHz boost multi-thread throughput
  • 12 MB L3 cache reduces data latency for demanding workloads
  • 95 W TDP balances performance with server power budgets
  • LGA-1366 socket fits compatible HPE ProLiant DL370 G6 systems
  • 32 nm process technology improves efficiency over older nodes

HPE Xeon X5675 Processor Upgrade

This refurbished HPE processor upgrade delivers six cores at 3.06 GHz for compatible ProLiant servers. It targets administrators who need to add compute capacity to existing Socket B LGA-1366 platforms without replacing the chassis. The part is identified by MPN 625073-B21 and belongs to the Xeon 5600 series.

95 W TDP and 81.3 °C Thermal Spec

The processor carries a thermal design power of 95 W and a maximum case temperature of 81.3 °C (178.3 °F). Power regulation adjusts consumption to workload demand, helping to contain heat output and fan noise in normal operation. Adequate server airflow is required to maintain these thermal limits.

Socket B LGA-1366 Mounting and Green Substrate

The package measures 1.7 inches wide by 1.8 inches deep and fits Socket B LGA-1366 sockets on supported Hewlett-Packard DL370 G6 systems. A green substrate distinguishes the unit visually during installation. Compatibility is limited to the stated server series; other platforms are not supported.

Highlights

  • Six cores at 3.06 GHz boost multi-thread throughput
  • 12 MB L3 cache reduces data latency for demanding workloads
  • 95 W TDP balances performance with server power budgets
  • LGA-1366 socket fits compatible HPE ProLiant DL370 G6 systems
  • 32 nm process technology improves efficiency over older nodes

Specifications

BrandHPE
TypeInterface Processor
ColorGreen
Shipping weight0.91 kg
Package size127 × 127 × 51 mm

Questions about this item

How is the HPE 625073-B21 processor installed in the Socket B LGA-1366, and what step is often missed?

Align the notches, lower the CPU gently, close the load plate and secure the lever; the step often missed is cleaning old thermal compound and applying a fresh thin layer before mounting the heatsink.

What maintenance will the X5675 3.06 GHz processor need over its service life?

Reapply thermal paste when the heatsink is removed and keep the server fans and air filters clean so the 95 W TDP stays within the 81.3 °C thermal specification.

What limit appears first when the hexa-core 5600 series CPU runs sustained workloads?

The 95 W thermal design power and 81.3 °C maximum case temperature are the first constraints; adequate airflow must remove heat continuously to avoid throttling.

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