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HP

HP P02592-B21 DL360 Gen10 Xeon-G 5218 Kit System

SKU CH-7VS3-NWGK7

Xeon 5218 processor kit for the HP ProLiant DL360 Gen10 server

  • HP DL360 Gen10 kit with Xeon 5218 processor for compute performance
  • New condition ensures reliable operation from first power-on
  • Part number P02592-B21 simplifies ordering and inventory tracking
  • Server accessory designed for DL360 Gen10 system integration

DL360 Gen10 Xeon-G 5218 Kit

This accessory kit is designed for the HP DL360 Gen10 server platform and includes a Xeon-G 5218 processor. It suits administrators upgrading compute capacity in existing Gen10 infrastructure. Buyers needing processors for other server generations or different socket types cannot use this kit.

Thermals noise and power draw

The Xeon-G 5218 processor operates within standard thermal limits for the DL360 Gen10 chassis. System fans adjust speed based on workload to maintain stable temperatures. Power consumption scales with CPU utilisation during normal operation.

Highlights

  • HP DL360 Gen10 kit with Xeon 5218 processor for compute performance
  • New condition ensures reliable operation from first power-on
  • Part number P02592-B21 simplifies ordering and inventory tracking
  • Server accessory designed for DL360 Gen10 system integration

Specifications

No published specifications for this item yet.

Questions about this item

How do I install the Xeon 5218 kit into the DL360 Gen10 server, and which step is most often missed?

Seat the processor kit firmly into the designated socket on the system board, then apply the included thermal interface material before locking the retention lever; the step most often missed is spreading the thermal material evenly across the heat-spreader surface.

What maintenance or replacement will the Xeon 5218 kit require during its service life in the DL360 Gen10?

The kit itself has no moving parts, so scheduled replacement is not needed; periodically verify that the heatsink remains securely fastened and that server fan speeds keep the processor within its thermal envelope.

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