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Green rectangular processor module with gold contacts and silver heat spreader, compact LGA 1366 form factor

HP

HP 638863-B21 Xeon X5675 3.06 GHz 6-core server accessory

SKU CH-C8WY-RSET1 MPN 638863-B21

Refurbished six-core Xeon processor upgrade running at 3.06 GHz with 12 MB L3 cache for compatible Hewlett-Packard servers

  • TypeInterface Processor
  • ColorGreen
  • Six cores at 3.06 GHz boost multi-thread throughput
  • 12 MB L3 cache speeds data access for heavy workloads
  • 95 W TDP balances performance with power draw
  • 40 GT/s QuickPath links accelerate core-to-core traffic
  • Fits LGA-1366 socket for direct ProLiant SL170s G6 upgrade

HP Xeon X5675 Processor Upgrade

This refurbished HP 638863-B21 processor upgrade adds a hexa-core Intel Xeon X5675 running at 3.06 GHz to compatible Hewlett-Packard servers. It targets administrators refreshing older ProLiant platforms that use the Socket B LGA-1366 interface. The 5600 series design regulates power draw automatically based on workload demand.

Socket B LGA-1366 and 95 W TDP

Verify that the target server board accepts a Socket B LGA-1366 processor and can dissipate a 95 W thermal design power within its chassis airflow limits. The part operates at a 1.4 V DC input voltage and carries a maximum case temperature spec of 81.3 °C. Confirm the system BIOS supports the 5600 series before installation.

Green PCB with 12 MB L3 cache

The processor ships on a green substrate measuring 1.7 inches by 1.8 inches and integrates 12 MB of L3 cache plus 1.50 MB of L2 cache. A QuickPath Interconnect link at 6.40 GT/s connects it to the chipset. Buyers needing higher core counts or newer instruction sets should consider alternative upgrade paths.

Highlights

  • Six cores at 3.06 GHz boost multi-thread throughput
  • 12 MB L3 cache speeds data access for heavy workloads
  • 95 W TDP balances performance with power draw
  • 40 GT/s QuickPath links accelerate core-to-core traffic
  • Fits LGA-1366 socket for direct ProLiant SL170s G6 upgrade

Specifications

BrandHP
TypeInterface Processor
ColorGreen
Shipping weight0.91 kg
Package size127 × 127 × 51 mm

Questions about this item

What is included with the 638863-B21 processor and what must be purchased separately?

The 638863-B21 is a processor upgrade only; a compatible heatsink and thermal paste for the LGA-1366 socket must be bought separately.

Which version of the Xeon X5675 should I select for my SL170s G6 ProLiant server?

Choose the 638863-B21 part number; it is the specific 3.06 GHz hexa-core model validated for the SL170s G6 ProLiant platform.

How does the 95 W TDP affect cooling requirements in a live server?

The 95 W thermal design power requires a server chassis and heatsink rated for at least 95 W dissipation at the 81.3 °C case temperature limit.

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