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GIGABYTE

GIGABYTE R283-Z96-AAE1 barebone server 2U 24-bay Gen5 NVMe DDR5

SKU CH-FAG3-FDY3Z MPN R283-Z96-AAE1

2U rackmount barebones server with dual SP5 sockets for AMD EPYC 9004 and 9005 series processors, 24 DDR5 memory slots, 24 front Gen5 NVMe bays, four rear SATA/SAS-4 bays, and dual 1 GbE LAN

  • Form Factor2U Rackmount
  • WorkloadAI/ML/HPC
  • CPU TypeAMD EPYC 9005 & 9004 Series
  • CPU SocketSocket SP5
  • Installed CPUNo CPU Installed
  • Max Processors2
  • Dual AMD EPYC 9004/9005 CPUs supported
  • 24 DDR5 4800 RDIMM slots, 12-channel memory
  • 24 front 2.5" Gen5 NVMe hot-swap bays
  • 4 rear 2.5" SATA/SAS-4 hot-swap bays
  • PCIe Gen5 x16 FHHL plus OCP NIC 3.0 slot

Dual-socket EPYC barebone for AI workloads

The GIGABYTE R283-Z96-AAE1 is a 2U rackmount barebone that accepts two AMD EPYC 9004 or 9005 series processors in SP5 sockets. It targets organisations building AI, machine learning or high-performance compute clusters who need dense local storage and high memory bandwidth. No CPU or memory is installed, so buyers choose exact core counts and capacities.

Sustained throughput with Gen5 NVMe and DDR5

Twenty-four front 2.5-inch bays connect directly to the CPUs via PCIe Gen5, twelve from each socket, delivering consistent bandwidth for large dataset ingest. Four rear bays add SATA or SAS-4 capacity through a CRS2810 controller. Twelve-channel DDR5-4800 registered memory scales to 6 TB per socket, keeping all cores fed during long training or simulation runs.

Replaces older dual-socket platforms lacking Gen5

This chassis upgrades installations still running PCIe 4.0 servers that cannot saturate modern accelerators or NVMe drives. The jump is worth it when workloads demand 128 cores per node, 50 percent more memory channels or direct CPU-attached Gen5 storage. It does not suit buyers who need GPU density beyond a single FHHL slot or 10 GbE networking out of the box.

Highlights

  • Dual AMD EPYC 9004/9005 CPUs supported
  • 24 DDR5 4800 RDIMM slots, 12-channel memory
  • 24 front 2.5" Gen5 NVMe hot-swap bays
  • 4 rear 2.5" SATA/SAS-4 hot-swap bays
  • PCIe Gen5 x16 FHHL plus OCP NIC 3.0 slot

Specifications

BrandGIGABYTE
ModelR283-S93-AAL1
Form Factor2U Rackmount
WorkloadAI/ML/HPC
CPU TypeAMD EPYC 9005 & 9004 Series
CPU SocketSocket SP5
Installed CPUNo CPU Installed
Max Processors2
CPU FeaturesDual processor, cTDP up to 300W
- EPYC 9654 cTDP up to 400W
Memory Slots24 x 288Pin
Installed Memory SizeNo Memory Installed
Memory Type SupportedDDR5 4800
Channel Supported12 Channel
RegisteredYes
Installed HDDNo Storage Installed
GPU/VPUAspeed AST2600
PCI Express1 x FHHL PCIe Gen5 x16 slot
1 x OCP NIC 3.0 PCIe Gen5 x16 slot
First LANIntel I350-AM2
Max. LAN Speed1 Gigabit
Hot-Swap BaysFront hot-swap:
24 x 2.5" Gen5 NVMe
- (12 x NVMe from CPU_0, 12 x NVMe from CPU_1)
Rear hot-swap:
4 x 2.5" SATA/SAS-4
- (SATA via CRS2810 from CPU_1)
Front USB2 x USB 3.2 Gen1 ports (Type-A)
Rear USB2 x USB 3.2 Gen1 ports (Type-A)
RJ452
Other Ports1 x Mini-DP
1 x MLAN port
Max. Power1+1 2000W 80 PLUS Platinum redundant power supplies
Fans4 x 80x80x38mm (18,300rpm)
TemperatureOperating temperature: 10°C to 35°C
Non-operating temperature: -40°C to 60°C
HumidityOperating humidity: 8%-80% (non-condensing)
Non-operating humidity: 20%-95% (non-condensing)
Dimensions3.44" x 17.24" x 32.09"
Package Contents1 x R283-Z96-AAE1
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
1 x 2-Section Rail kit
Shipping weight40.00 kg
Package size8150 × 4380 × 875 mm

Questions about this item

How much heat does the 300 W cTDP per processor generate when the server runs all day?

Each EPYC 9004 or 9005 processor can reach a configurable TDP of 300 W, so a dual-socket build may dissipate up to 600 W under sustained load.

Which DDR5 modules must I supply because the chassis ships empty?

You need 288-pin registered DDR5-4800 RDIMMs; the board provides 24 slots across 12 channels per socket.

Will my existing SATA SSDs work in the rear hot-swap bays?

Yes, the four rear 2.5" bays accept SATA drives through the CRS2810 controller connected to the second CPU.

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