GIGABYTE
GIGABYTE R283-S93-AAL1 barebone server 2U dual Xeon 32 DIMM DDR5 2700W
2U rackmount barebone for dual Xeon CPUs with 32 DDR5 slots, dual 2700 W power and two full-height PCIe Gen5 GPU bays
- Form Factor2U Rackmount
- WorkloadAI/ML/HPC
- CPU Type5th / 4th Generation Intel Xeon Scalable Processors, Intel X
- CPU SocketLGA 4677
- Installed CPUNo CPU Installed
- Max Processors2
- Dual 5th/4th Gen Intel Xeon Scalable processors for AI/HPC workloads
- 32 DDR5 5600 RDIMM slots across 8 channels for maximum memory bandwidth
- 2 FHFL PCIe Gen5 x16 GPU slots for NVIDIA-certified accelerator support
- 4 hot-swap 3.5/2.5-inch Gen4 NVMe/SATA/SAS bays for flexible storage
- 2700W redundant power supporting 350W TDP CPUs at 25°C ambient
Dual-processor 2U server for AI and HPC workloads
The GIGABYTE R283-S93-AAL1 is a barebone rackmount server built for dual 5th or 4th Generation Intel Xeon Scalable processors including the Xeon CPU Max Series with HBM. It targets organisations deploying AI, machine learning and high-performance computing clusters that require dense GPU acceleration and fast memory bandwidth. The platform ships without CPUs, memory or storage installed.
2700 W redundant power with CPU TDP up to 350 W
Dual 2700 W power supplies deliver redundant power for two processors each rated up to 350 W TDP at 25 °C ambient. The 2U chassis houses the Aspeed AST2600 baseboard management controller and Intel I350-AM2 dual 1 Gb/s LAN for out-of-band management. Thermal design supports sustained GPU and CPU loads in dense rack environments.
32 DDR5 slots and dual-slot Gen5 GPU capacity
The board provides 32 x 288-pin DDR5 5600 RDIMM slots across eight channels per processor. Expansion includes two full-height full-length PCIe Gen5 x16 slots for dual-slot Gen5 GPUs, two full-height half-length PCIe Gen5 x16 slots, four low-profile PCIe Gen5 x8 slots and two OCP NIC 3.0 PCIe Gen5 x16 slots. Four hot-swap bays accept 3.5" or 2.5" Gen4 NVMe, SATA or SAS drives.
Highlights
- Dual 5th/4th Gen Intel Xeon Scalable processors for AI/HPC workloads
- 32 DDR5 5600 RDIMM slots across 8 channels for maximum memory bandwidth
- 2 FHFL PCIe Gen5 x16 GPU slots for NVIDIA-certified accelerator support
- 4 hot-swap 3.5/2.5-inch Gen4 NVMe/SATA/SAS bays for flexible storage
- 2700W redundant power supporting 350W TDP CPUs at 25°C ambient
Specifications
| Brand | GIGABYTE |
|---|---|
| Model | R283-S93-AAL1 |
| Form Factor | 2U Rackmount |
| Workload | AI/ML/HPC |
| CPU Type | 5th / 4th Generation Intel Xeon Scalable Processors, Intel Xeon CPU Max Series |
| CPU Socket | LGA 4677 |
| Installed CPU | No CPU Installed |
| Max Processors | 2 |
| CPU Features | Dual processor, TDP 350W at ambient 25°C |
| North Bridge | Intel C741 |
| Memory Slots | 32 x 288Pin |
| Installed Memory Size | No Memory Installed |
| Memory Type Supported | DDR5 5600 |
| Channel Supported | 8 Channel |
| Registered | Yes |
| Installed HDD | No Storage Installed |
| GPU/VPU | Aspeed AST2600 |
| PCI Express | 2 x FHFL PCIe Gen5 x16 slots for GPUs 2 x FHHL PCIe Gen5 x16 slots 4 x LP PCIe Gen5 x8 slots 2 x OCP NIC 3.0 PCIe Gen5 x16 slots |
| First LAN | Intel I350-AM2 |
| Max. LAN Speed | 1 Gigabit |
| Hot-Swap Bays | Front hot-swap: 4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS 8 x 3.5"/2.5" SATA/SAS - (NVMe from CPU_1) |
| Front USB | 2 x USB 3.2 Gen1 ports (Type-A) |
| Rear USB | 2 x USB 3.2 Gen1 ports (Type-A) |
| RJ45 | 2 |
| Other Ports | 1 x Mini-DP 1 x MLAN port |
| Max. Power | 1+1 2700W 80 PLUS Titanium redundant power supplies |
| Fans | 8 x 40x40x56mm (32,000rpm) |
| Temperature | Operating temperature: 10°C to 35°C Non-operating temperature: -40°C to 60°C |
| Humidity | Operating humidity: 8%-80% (non-condensing) Non-operating humidity: 20%-95% (non-condensing) |
| Dimensions | 3.44" x 17.24" x 32.09" |
| Package Contents | 1 x R283-S93-AAF1 2 x CPU heatsinks 1 x Mini-DP to D-Sub cable 2 x GPU power cables (CPU 8pin, 350mm) 6 x Carriers 1 x 2-Section Rail kit |
| Shipping weight | 30.00 kg |
| Package size | 1077 × 679 × 300 mm |
Questions about this item
How do I install the dual Xeon processors into the LGA 4677 sockets, and what step is most often missed?
Align each CPU using the socket keying, lower the independent loading mechanisms one at a time, then torque the retention screws to the specified sequence; the step most often missed is applying thermal interface material before seating the heat-sink assembly.
Which components will need replacement first during long-term operation?
The 2700 W redundant power supplies and system fans are the primary field-replaceable units; DDR5 RDIMMs and NVMe drives can also be swapped hot-plug, but the Aspeed AST2600 BMC and Intel C741 chipset are soldered and not user-serviceable.
What thermal limit appears first when both 350 W CPUs and two Gen5 GPUs run sustained workloads?
The 350 W per-processor TDP rating at 25 °C ambient is the first constraint; exceeding it triggers CPU throttling before the 2700 W power budget or PCIe Gen5 signal integrity limits are reached.
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