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Silver 1U rackmount server chassis with twelve 2.5-inch drive bays at the front

GIGABYTE

GIGABYTE R183-S92-AAD1 barebone server 1U 12-bay 32 DIMM

SKU CH-G838-2Y2YH MPN R183-S92-AAD1

A 1U rackmount barebones server holding twelve 2.5-inch NVMe, SATA or SAS hot-swap bays and thirty-two DDR5 DIMM slots for dual Xeon processors up to 350 W TDP

  • Form Factor1U Rackmount
  • WorkloadAI/ML/HPC
  • CPU Type5th / 4th Generation Intel Xeon Scalable Processors, Intel X
  • CPU SocketLGA 4677
  • Installed CPUNo CPU Installed
  • Max Processors2
  • Dual 5th/4th Gen Intel Xeon Scalable processors deliver high compute density
  • 32 DDR5 5600 RDIMM slots provide massive memory capacity for AI/HPC workloads
  • 12 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays enable flexible high-speed storage
  • 2 FHHL PCIe Gen5 x16 slots plus 2 OCP NIC 3.0 Gen5 x16 slots offer extensive accelerator connectivity
  • Aspeed AST2600 GPU/VPU with dual 1Gb/s LAN ports ensures reliable remote management

1U 12-bay barebone for dual Xeon Scalable

This 1U rackmount barebone supports two 5th or 4th Generation Intel Xeon Scalable processors and the Intel Xeon CPU Max Series in LGA 4677 sockets. It targets AI, machine learning and HPC workloads with dual-processor capability and up to 350 W TDP per CPU. No processors or memory are installed.

Suits compute-dense clusters needing Gen5 NVMe

Organisations building dense inference or training clusters benefit from twelve 2.5-inch Gen4 NVMe, SATA or SAS hot-swap bays and two FHHL PCIe Gen5 x16 slots. Buyers who need more than two sockets, larger drive bays or pre-installed CPUs should evaluate other platforms.

32 DDR5 5600 RDIMM slots in 8 channels

The Intel C741 chipset provides 32 DDR5 5600 registered DIMM slots across eight memory channels. This capacity decides whether the platform matches your memory-footprint requirements for large-model training or in-memory analytics.

Highlights

  • Dual 5th/4th Gen Intel Xeon Scalable processors deliver high compute density
  • 32 DDR5 5600 RDIMM slots provide massive memory capacity for AI/HPC workloads
  • 12 x 2.5" Gen4 NVMe/SATA/SAS hot-swap bays enable flexible high-speed storage
  • 2 FHHL PCIe Gen5 x16 slots plus 2 OCP NIC 3.0 Gen5 x16 slots offer extensive accelerator connectivity
  • Aspeed AST2600 GPU/VPU with dual 1Gb/s LAN ports ensures reliable remote management

Specifications

BrandGIGABYTE
ModelR183-S92-AAD1
Form Factor1U Rackmount
WorkloadAI/ML/HPC
CPU Type5th / 4th Generation Intel Xeon Scalable Processors, Intel Xeon CPU Max Series
CPU SocketLGA 4677
Installed CPUNo CPU Installed
Max Processors2
CPU FeaturesDual processor, TDP up to 350W
North BridgeIntel C741
Memory Slots32 x 288Pin
Installed Memory SizeNo Memory Installed
Memory Type SupportedDDR5 5600
Channel Supported8 Channel
RegisteredYes
Installed HDDNo Storage Installed
GPU/VPUAspeed AST2600
PCI Express2 x FHHL PCIe Gen5 x16 slots
2 x OCP NIC 3.0 PCIe Gen5 x16 slots
First LANIntel I350-AM2
Max. LAN Speed1 Gigabit
Hot-Swap BaysFront hot-swap:
12 x 2.5" Gen4 NVMe/SATA/SAS
- (6 x NVMe from CPU_0, 6 x NVMe from CPU_1)
Front USB1 x USB 3.2 Gen1 port (Type-A)
Rear USB2 x USB 3.2 Gen1 ports (Type-A)
RJ452
Other Ports1 x Mini-DP
1 x MLAN port
Max. PowerDual 1600W 80 PLUS Platinum redundant power supply
Fans8 x 40x40x56mm (32,000rpm)
TemperatureOperating temperature: 10°C to 35°C
Non-operating temperature: -40°C to 60°C
HumidityOperating humidity: 8%-80% (non-condensing)
Non-operating humidity: 20%-95% (non-condensing)
Dimensions1.71" x 17.24" x 32.09"
Package Contents1 x R183-S92-AAD1
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
6 x Carriers
1 x 2-Section Rail kit
Shipping weight24.83 kg
Package size1045 × 595 × 249 mm

Questions about this item

Should I pick the 12-bay NVMe version or a SAS/SATA alternative?

This model provides exactly 12 hot-swap 2.5" bays that each accept Gen4 NVMe, SATA or SAS drives, so you choose the media type per bay rather than picking a different chassis.

What does the 350 W TDP limit mean once I install two Xeon processors?

Each socket supports up to 350 W, so the cooling and power subsystem are sized for two high-frequency Xeon Scalable or Xeon CPU Max Series chips running at their rated thermal ceiling.

How do the PCIe Gen5 x16 slots and OCP NIC 3.0 slots constrain add-in cards?

Two full-height half-length PCIe Gen5 x16 slots and two OCP NIC 3.0 PCIe Gen5 x16 slots share the CPU lanes, capping each device at Gen5 x16 bandwidth for GPUs, accelerators or high-speed networking.

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