GIGABYTE
GIGABYTE R163-Z30-AAB1 barebone server 1U AMD EPYC 9004/9005 12 DIMM 4-bay Gen4 NVMe/SATA/SAS
1U rackmount barebone supporting AMD EPYC 9004/9005 with 12 DDR5 slots, 4 hot-swap Gen4 NVMe/SATA/SAS bays and PCIe Gen5 expansion
- Form Factor1U Rackmount
- WorkloadGeneral Purpose Server
- CPU TypeAMD EPYC 9005 & 9004 Series
- CPU SocketSocket SP5
- Installed CPUNo CPU Installed
- Max Processors1
- Supports AMD EPYC 9004 and 9005 series processors
- 12 DDR5 RDIMM slots deliver up to 4800 MT/s memory speed
- Four hot-swap bays accept 3.5" or 2.5" Gen4 NVMe, SATA or SAS drives
- Two FHHL PCIe Gen5 x16 slots plus two OCP NIC 3.0 Gen5 x16 slots for expansion
- Single processor design with cTDP up to 300 W at 25 °C ambient
1U EPYC 9004/9005 barebone
This 1U rackmount barebone supports a single AMD EPYC 9004 or 9005 series processor up to 300W cTDP at 25°C ambient. It provides 12 DDR5 RDIMM slots running at up to 4800 MT/s across 12 channels. The chassis includes four hot-swap bays accepting 3.5" or 2.5" Gen4 NVMe, SATA or SAS drives.
Expansion and networking
Two full-height half-length PCIe Gen5 x16 slots and two OCP NIC 3.0 PCIe Gen5 x16 slots handle accelerators or high-speed network cards. A single M.2 slot with PCIe Gen3 x4 interface supports 2280 or 22110 form factors. One 1Gb/s LAN port via Intel I210-AT provides basic management connectivity.
Pre-order checks
Verify the selected EPYC processor TDP does not exceed the 300W cTDP limit at 25°C ambient. Confirm DDR5 RDIMM modules are registered and rated for 4800 MT/s operation. Ensure any NVMe, SATA or SAS drives fit the 3.5" or 2.5" hot-swap carrier dimensions. Check that PCIe Gen5 add-in cards and OCP 3.0 modules match the x16 slot electrical and mechanical specifications.
Highlights
- Supports AMD EPYC 9004 and 9005 series processors
- 12 DDR5 RDIMM slots deliver up to 4800 MT/s memory speed
- Four hot-swap bays accept 3.5" or 2.5" Gen4 NVMe, SATA or SAS drives
- Two FHHL PCIe Gen5 x16 slots plus two OCP NIC 3.0 Gen5 x16 slots for expansion
- Single processor design with cTDP up to 300 W at 25 °C ambient
Specifications
| Brand | GIGABYTE |
|---|---|
| Model | R163-Z30-AAB1 |
| Form Factor | 1U Rackmount |
| Workload | General Purpose Server |
| CPU Type | AMD EPYC 9005 & 9004 Series |
| CPU Socket | Socket SP5 |
| Installed CPU | No CPU Installed |
| Max Processors | 1 |
| CPU Features | Single processor, cTDP up to 300W - At 25°C ambient, cTDP up to 400W |
| Memory Slots | 12 x 288Pin |
| Installed Memory Size | No Memory Installed |
| Memory Type Supported | RDIMM: Up to 4800 MT/s |
| Channel Supported | 12 Channel |
| Registered | Yes |
| Installed HDD | No Storage Installed |
| M.2 | 1 x M.2 (2280/22110), PCIe Gen3 x4 |
| PCI Express | 2 x FHHL PCIe Gen5 x16 slots 2 x OCP NIC 3.0 PCIe Gen5 x16 slots |
| Hot-Swap Bays | 4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS |
| Buttons | 1 x NMI button 1 x Reset button |
| LEDs | 1 x Power button with LED 1 x ID button with LED 2 x LAN activity LEDs (1 x LED disabled) 1 x Storage activity LED 1 x System status LED |
| Front USB | 2 x USB 3.2 Gen1 ports (Type-A) |
| Rear USB | 2 x USB 3.2 Gen1 ports (Type-A) |
| RJ45 | 1 |
| Other Ports | 1 x MLAN |
| DisplayPort | 1 x Mini DisplayPort |
| Max. Power | 1+1 800W 80 PLUS Platinum redundant power supplies |
| Fans | 2 x 40x40x28mm (25,000rpm) 4 x 40x40x56mm (29,700rpm) |
| Temperature | Operating temperature: 10°C to 35°C Non-operating temperature: -40°C to 60°C |
| Humidity | Operating humidity: 8%-80% (non-condensing) Non-operating humidity: 20%-95% (non-condensing) |
| Dimensions | 1.71" x 17.24" x 27.95" |
| Weight | 45.79 lbs. |
| Package Contents | 1 x R163-Z30-AAB1 1 x CPU heatsink 1 x Mini-DP to D-Sub cable 1 x 2-Section Rail kit |
| Shipping weight | 23.14 kg |
| Package size | 1038 × 588 × 238 mm |
Questions about this item
What memory modules will need replacing when the twelve DDR5 RDIMM slots reach their 4800 MT/s limit?
Registered DDR5 RDIMM modules rated for up to 4800 MT/s populate all twelve 288-pin slots and are the only memory type supported for future upgrades.
Which thermal ceiling appears first when the single EPYC processor runs at its 300 W cTDP continuously?
The platform is rated for 300 W cTDP at 25 °C ambient; sustained loads at that level will hit the processor's thermal design limit before the chassis cooling capacity is exceeded.
How loud and hot does the 1U chassis get when all four Gen4 NVMe bays and both PCIe Gen5 slots are active all day?
With a 300 W cTDP processor, four hot-swap drive bays and two full-height PCIe Gen5 cards, the 1U enclosure relies on high-speed internal fans that generate noticeable airflow noise and exhaust heat under continuous load.
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