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Silver 2U rack server chassis with four rear-access compute nodes and eight 2.5-inch hot-swap drive bays

GIGABYTE

GIGABYTE H274-S61-AAW1 barebone server 2U 4-node 8-bay Gen5 NVMe/SATA/SAS-4

SKU CH-K4J6-8EVXT MPN H274-S61-AAW1

2U barebone holds four dual-socket Xeon 6 nodes with 64 DDR5 slots, eight Gen5 NVMe/SATA/SAS-4 bays and four PCIe 5.0 expansion slots

  • Form Factor2U Rackmount
  • WorkloadAI/ML/HPC
  • CPU TypeIntel Xeon 6 Processors - Intel Xeon 6700-Series Processors
  • CPU SocketLGA 4710
  • Installed CPUNo CPU Installed
  • Max Processors8
  • Dual Intel Xeon 6 processors per node deliver high compute density
  • 8-channel DDR5 RDIMM and MRDIMM up to 8000 MT/s maximise memory throughput
  • 8 hot-swap 2.5-inch bays support Gen5 NVMe SATA SAS-4 storage
  • Four LP PCIe Gen5 x16 slots enable GPU and accelerator expansion
  • Four OCP NIC 3.0 PCIe Gen5 x16 slots provide flexible networking

2U 4-node server chassis

The GIGABYTE H274-S61-AAW1 is a 2U rackmount barebones system housing four independent compute nodes. Each node supports dual Intel Xeon 6 processors in LGA 4710 sockets with TDPs up to 350 W. The platform targets AI, ML and HPC workloads that demand high core density and memory throughput in a compact form factor.

Suits dense compute clusters, not single-node builds

This chassis fits integrators deploying multi-node clusters for parallel workloads who can supply their own CPUs, memory and storage. It does not suit buyers needing a single-socket tower, a system with pre-installed processors or a platform limited to air-cooled TDPs below 270 W per CPU.

8-channel DDR5 RDIMM and MRDIMM support

Each node provides 16 DIMM slots across eight memory channels, accepting RDIMM modules up to 6400 MT/s and MRDIMM modules up to 8000 MT/s. This channel count and speed ceiling determine the memory bandwidth available for the intended high-performance applications.

Highlights

  • Dual Intel Xeon 6 processors per node deliver high compute density
  • 8-channel DDR5 RDIMM and MRDIMM up to 8000 MT/s maximise memory throughput
  • 8 hot-swap 2.5-inch bays support Gen5 NVMe SATA SAS-4 storage
  • Four LP PCIe Gen5 x16 slots enable GPU and accelerator expansion
  • Four OCP NIC 3.0 PCIe Gen5 x16 slots provide flexible networking

Specifications

BrandGIGABYTE
ModelH274-S61-AAW1
Form Factor2U Rackmount
WorkloadAI/ML/HPC
CPU TypeIntel Xeon 6 Processors
- Intel Xeon 6700-Series Processors
- Intel Xeon 6500-Series Processors
CPU SocketLGA 4710
Installed CPUNo CPU Installed
Max Processors8
CPU FeaturesDual processor per node, TDP up to 270W
- No OCP cards at 35°C ambient, TDP up to 350W
- With OCP cards at 30°C ambient, TDP up to 350W
Memory Slots64 x 288Pin
Installed Memory SizeNo Memory Installed
Memory Type SupportedRDIMM: Up to 6400 MT/s
MRDIMM: Up to 8000 MT/s
Channel Supported8 Channel
RegisteredYes
Installed HDDNo Storage Installed
GPU/VPUAspeed AST2600
PCI Express4 x LP PCIe Gen5 x16 slots
4 x OCP NIC 3.0 PCIe Gen5 x16 slots
First LAN4 x Intel I350-AM2
Max. LAN Speed1 Gigabit
Hot-Swap Bays8 x 2.5" Gen5 NVMe/SATA/SAS-4
- (NVMe & SATA from CPU_1)
Buttons4 x Reset buttons
1 x CMC reset button
LEDs4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
1 x CMC status LED
DisplayPort4 x Mini DisplayPorts
Rear USB8 x USB 3.2 Gen1 ports (Type-A)
RJ458
Other Ports4 x MLAN
Max. PowerDual 3000W 80 PLUS Titanium redundant power supply
Fans4 x 80x80x80mm (16,500rpm)
TemperatureOperating temperature: 10°C to 35°C
Non-operating temperature: -40°C to 60°C
HumidityOperating humidity: 8-80% (non-condensing)
Non-operating humidity: 20%-95% (non-condensing)
Dimensions2U 4-Node - Rear access
3.44" x 17.32" x 34.53"
Package Contents1 x H274-S61-AAW1
8 x CPU heatsinks
1 x Mini-DP to D-Sub cable
16 x Carriers
1 x 3-Section Rail kit
Shipping weight30.00 kg
Package size1179 × 700 × 380 mm

Questions about this item

How many 2.5-inch hot-swap bays does the H274-S61-AAW1 provide, and which protocols do they support?

The chassis has eight 2.5-inch hot-swap bays that accept Gen5 NVMe, SATA and SAS-4 drives, with NVMe and SATA connections routed from CPU 1.

What CPU socket and cooling clearance does each node require for the Intel Xeon 6 processors?

Each node uses an LGA 4710 socket and supports dual processors with a TDP up to 270 W without OCP cards at 35 °C ambient, or up to 350 W with OCP cards at 30 °C ambient.

How many DDR5 memory slots are available per node, and what speeds do they support?

Each node provides 16 DDR5 slots (64 total) across eight channels, supporting RDIMM up to 6400 MT/s and MRDIMM up to 8000 MT/s.

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