GIGABYTE
GIGABYTE H263-S64-AAW1 barebone server 2U 4-node 64 DIMM 8-bay 3000W
A 2U four-node barebone server supporting dual Xeon processors per node, 64 DDR5 DIMM slots and eight 2.5-inch Gen4 NVMe/SATA/SAS hot-swap bays with a 3000W power supply
- Form Factor2U Rackmount
- WorkloadAI/ML/HPC
- CPU Type5th / 4th Generation Intel Xeon Scalable Processors and Inte
- CPU SocketLGA 4677
- Installed CPUNo CPU Installed
- Max Processors8
- 4-node 2U design packs maximum compute density
- Dual Xeon Scalable CPUs per node scale AI workloads
- 64 DDR5 RDIMM slots deliver high memory bandwidth
- 8 hot-swap 2.5" bays support Gen4 NVMe/SATA/SAS
- 3000W redundant power sustains 350W TDP processors
High-density 4-node server barebones
The GIGABYTE H263-S64-AAW1 is a 2U rackmount chassis that holds four independent compute nodes, each supporting dual Intel Xeon Scalable processors. It targets AI, machine-learning and high-performance computing clusters that need maximum core density in minimal rack space. No processors or memory are installed, so integrators choose exact SKUs for their workload.
Dual-socket nodes with 64 DDR5 slots and Gen4
Each node provides 16 DDR5 RDIMM slots across eight channels, reaching 5600 MT/s with 5th Gen Xeon and 4800 MT/s with 4th Gen or Max Series CPUs. Eight 2.5-inch hot-swap bays accept Gen4 NVMe, SATA or SAS drives, with NVMe lanes routed from the first CPU. Four low-profile PCIe Gen5 x16 slots and four OCP NIC 3.0 Gen5 x16 slots per system enable high-speed accelerators and networking.
Verify CPU TDP limits and power budget
The 3000 W redundant supply supports per-CPU TDP up to 270 W at 30 °C ambient, rising to 350 W at 35 °C when no OCP card is fitted. Confirm selected Xeon SKUs stay within these thermal envelopes. Ensure DDR5 RDIMMs match the 288-pin, registered specification and that storage drives fit 2.5-inch Gen4 NVMe, SATA or SAS interfaces.
Highlights
- 4-node 2U design packs maximum compute density
- Dual Xeon Scalable CPUs per node scale AI workloads
- 64 DDR5 RDIMM slots deliver high memory bandwidth
- 8 hot-swap 2.5" bays support Gen4 NVMe/SATA/SAS
- 3000W redundant power sustains 350W TDP processors
Specifications
| Brand | GIGABYTE |
|---|---|
| Model | H263-S64-AAW1 |
| Form Factor | 2U Rackmount |
| Workload | AI/ML/HPC |
| CPU Type | 5th / 4th Generation Intel Xeon Scalable Processors and Intel Xeon CPU Max Series |
| CPU Socket | LGA 4677 |
| Installed CPU | No CPU Installed |
| Max Processors | 8 |
| CPU Features | Dual processor per node, TDP up to 270W - At 30°C ambient, TDP up to 350W - With no OCP card at 35°C ambient, TDP up to 350W |
| North Bridge | Intel C741 |
| Memory Slots | 64 x 288Pin |
| Installed Memory Size | No Memory Installed |
| Memory Type Supported | 5th Gen Intel Xeon: RDIMM: Up to 5600 MT/s 4th Gen Intel Xeon: RDIMM: Up to 4800 MT/s Intel Xeon Max Series: RDIMM: Up to 4800 MT/s |
| Channel Supported | 8 Channel |
| Registered | Yes |
| Installed HDD | No Storage Installed |
| GPU/VPU | Aspeed AST2600 |
| PCI Express | 4 x LP PCIe Gen5 x16 slots 4 x OCP NIC 3.0 PCIe Gen5 x16 slots |
| Max. LAN Speed | 1 Gigabit |
| Hot-Swap Bays | 8 x 2.5" Gen4 NVMe/SATA/SAS - (NVMe from CPU_1) |
| Buttons | 4 x Reset buttons 1 x CMC reset button |
| LEDs | 4 x Power buttons with LED 4 x ID buttons with LED 4 x System status LEDs 1 x CMC status LED |
| VGA | 4 x VGA |
| Rear USB | 8 x USB 3.2 Gen1 ports (Type-A) |
| RJ45 | 4 |
| Other Ports | 4 x MLAN 1 x CMC port |
| Max. Power | Dual 3000W 80 PLUS Titanium redundant power supply |
| Fans | 4 x 80x80x80mm (16,500rpm) |
| Temperature | Operating temperature: 10°C to 35°C Non-operating temperature: -40°C to 60°C |
| Humidity | Operating humidity: 8-80% (non-condensing) Non-operating humidity: 20%-95% (non-condensing) |
| Dimensions | 3.44" x 17.32" x 33.07" |
| Weight | 108.03 lbs. |
| Package Contents | 1 x H263-S64-AAW1 8 x CPU heatsinks 24 x Carriers 1 x 3-Section Rail kit |
| Shipping weight | 51.37 kg |
| Package size | 1168 × 709 × 386 mm |
Questions about this item
Will the 64 DDR5 RDIMM slots need firmware updates when larger-capacity modules arrive?
The platform supports 5th Gen Xeon RDIMMs up to 5600 MT/s and 4th Gen or Xeon Max Series up to 4800 MT/s; larger modules that fit those speeds will work without extra firmware.
Which thermal limit appears first when all four nodes run dual 350 W CPUs continuously?
At 30 °C ambient the CPUs are rated to 350 W; at 35 °C ambient the same limit applies only when no OCP card is installed, so the OCP slot is the first constraint.
How loud and hot does the 3000 W power supply get under full 4-node load?
The 3000 W redundant supply is designed for the 350 W per-CPU thermal envelope; fan speed ramps with inlet temperature, keeping noise proportional to the 30 °C or 35 °C operating points.
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