GELID SOLUTIONS
GELID SOLUTIONS GP-Ultimate 15W/mK Thermal Pad 90x50x3.0mm
High-conductivity 15W/mK thermal pad measuring 90x50x3.0mm for GPU, motherboard and SMD component cooling
Option 90 x 50 x 3.0 mm
- 90 x 50 x 3.0 mm
- 90 x 50 x 2.0 mm
- 90 x 50 x 1.0 mm
- 90 x 50 x 0.5 mm
- 15W/mK conductivity transfers heat efficiently from hot components
- Non-electrically conductive material prevents short circuits on dense PCBs
- Soft 3.0mm thickness conforms to uneven surfaces and height differences
- 90x50mm pad covers large GPU, motherboard or add-on card areas
- Stable from -60°C to 220°C for reliable long-term operation
High-conductivity thermal pad for dense PCBs
The GP-Ultimate thermal pad delivers 15 W/mK conductivity in a 90 x 50 mm sheet with 3.0 mm thickness. It bridges uneven surfaces on GPUs, motherboards and add-in cards where components sit at different heights. The material is non-electrically conductive, non-corrosive, non-curing and non-toxic. It remains stable from -60 °C to 220 °C.
Pre-cut sheet simplifies installation on large areas
Each pack contains one 90 x 50 mm pad ready to place without cutting or spreading. The soft multilayer matrix conforms to MOSFETs, chipsets, memory ICs and micro-controllers, filling gaps that paste cannot reach. Because it does not harden, it maintains contact through thermal cycling and can be repositioned during assembly.
Suits builders fixing hot spots on graphics cards
This pad targets enthusiasts replacing factory pads on GPU VRMs, memory modules or console heatspreaders. It is less suited for users who need thinner shims such as 0.5 mm, 1.0 mm, 1.5 mm or 2.0 mm variants for tighter clearances. Buyers requiring electrically conductive interfaces or sub-zero operation below -60 °C should consider alternative materials.
Highlights
- 15W/mK conductivity transfers heat efficiently from hot components
- Non-electrically conductive material prevents short circuits on dense PCBs
- Soft 3.0mm thickness conforms to uneven surfaces and height differences
- 90x50mm pad covers large GPU, motherboard or add-on card areas
- Stable from -60°C to 220°C for reliable long-term operation
Specifications
No published specifications for this item yet.
Other versions of this model
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GELID SOLUTIONS GP-Ultimate 15W/mK Thermal Pad 90x50x2.0mm chipset cooling
Questions about this item
Will the 3.0mm pad need replacement after long-term use?
The pad is non-hardening and non-curing, so it does not dry out or degrade like traditional thermal paste. It maintains its thermal properties across the full operating range of -60°C to 220°C without requiring scheduled replacement.
What limits performance when the GPU runs hot for hours?
The pad's thermal conductivity is rated at 15W/mK. Under sustained heavy load, this material limit determines how quickly heat moves from the die to the heatsink, capping the maximum achievable cooling efficiency.
Does the pad get hot or consume power during all-day operation?
The pad is a passive component with zero power draw. It generates no noise and no heat of its own; it simply conducts waste heat from the component to the cooler across its 90x50mm surface area.
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