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Grey rectangular thermal pad 90 by 50 by 2.0mm

GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate 15W/mK Thermal Pad 90x50x2.0mm chipset cooling

SKU CH-3JX7-065PN

High-conductivity 15W/mK thermal pad, 90x50x2.0mm, non-electrically conductive and non-curing for chipset and memory IC cooling

Option 90 x 50 x 2.0 mm

  • 15 W/mK thermal conductivity moves heat fast from chip to heatsink
  • Non-conductive, non-corrosive, non-toxic material protects sensitive electronics
  • Soft 2.0 mm thickness conforms to uneven surfaces and height differences
  • 90 × 50 mm sheet covers large PCB areas on GPUs and motherboards
  • Operates reliably from -60 °C to 220 °C without hardening

Purpose and fit

This thermal pad targets builders who need to bridge uneven gaps between heatsinks and components such as MOSFETs, chipsets or memory ICs. The 90x50mm sheet suits larger PCB areas on graphics cards, motherboards or add-in boards. It is not for users who require a thinner or thicker interface than the 2.0mm thickness supplied.

Build and daily handling

The pad uses a multilayer matrix that stays pliable across an operating range of -60°C to 220°C without hardening or curing. Being non-electrically conductive, non-corrosive and non-toxic, it can be handled safely and left in place for long periods. The 90x50mm dimensions allow easy positioning on sizeable component clusters without cutting.

Deciding specification

Thermal conductivity is rated at 15W/mK, the single figure that determines whether the pad can move enough heat for a given component. If the design demands a different conductivity value or a thickness other than 2.0mm, this specific sheet will not match the requirement.

Highlights

  • 15 W/mK thermal conductivity moves heat fast from chip to heatsink
  • Non-conductive, non-corrosive, non-toxic material protects sensitive electronics
  • Soft 2.0 mm thickness conforms to uneven surfaces and height differences
  • 90 × 50 mm sheet covers large PCB areas on GPUs and motherboards
  • Operates reliably from -60 °C to 220 °C without hardening

Specifications

No published specifications for this item yet.

Other versions of this model

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Questions about this item

What thermal conductivity does the 15W/mK pad provide for chipset cooling?

The pad delivers 15W/mK thermal conductivity to transfer heat from chipsets, MOSFETs and other SMD components to the heatsink across uneven surfaces.

Will the 90x50x2.0mm pad fit my GPU memory or motherboard chipset?

The pad measures 90mm by 50mm with a 2.0mm thickness, sized for large PCB areas on graphics cards, motherboards and add-on cards.

How do I install the non-conductive pad without damaging components?

Clean both surfaces, peel the protective film, place the soft pad onto the component and press the heatsink down evenly; the material is non-electrically conductive and non-curing.

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