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White 3.5g syringe of GC-4 thermal compound with applicator tip

GELID SOLUTIONS

GELID SOLUTIONS GC-4 3.5g thermal paste

SKU CH-6G5N-RYS4J

A 3.5 g thermal compound with synthetic micron-particle filler for CPU, GPU and chipset heat transfer from -30 to 150 °C

  • Volume / Net Weight3.5g
  • Long Term Operating Temperature-30~150
  • FeaturesGC-4 comes with the enhanced micron-particle synthetic therm
  • Ultra-efficient heat transfer from CPU, GPU and chipset
  • Stable performance across -30 °C to 150 °C operating range
  • Non-electrically conductive formula prevents short-circuit risk
  • Micron-particle synthetic filler ensures perfect gap filling
  • 5 g syringe with applicator for easy application

GC-4 3.5g thermal compound

GELID SOLUTIONS GC-4 is a 3.5 gram thermal compound designed for CPU, GPU and chipset heat sinks. It uses enhanced micron-particle synthetic filler in a polymer matrix to deliver high conductivity and optimal viscosity. The paste is non-electrically conductive and non-corrosive for safe application on sensitive components. An applicator is included to simplify the process.

Replacing dried or basic paste

This compound upgrades from dried-out stock paste or lower-grade ceramics that lose effectiveness over time. The jump is worth it when temperatures climb under sustained load or when a cooler is reseated after maintenance. Its wide operating range from -30 to 150 Celsius keeps performance stable in extreme environments. It suits builders who need reliable long-term thermal transfer without frequent reapplication.

Simple application with included tool

The bundled applicator spreads the compound evenly across the heat spreader for consistent coverage. Optimal viscosity prevents the paste from running or clumping during installation. Non-electrical conductivity removes the risk of short circuits if excess material contacts nearby components. Non-curing formula means the paste stays pliable, making future cooler removal straightforward.

Highlights

  • Ultra-efficient heat transfer from CPU, GPU and chipset
  • Stable performance across -30 °C to 150 °C operating range
  • Non-electrically conductive formula prevents short-circuit risk
  • Micron-particle synthetic filler ensures perfect gap filling
  • 5 g syringe with applicator for easy application

Specifications

BrandGELID Solutions
SeriesGC-4
Volume / Net Weight3.5g
Long Term Operating Temperature-30~150
FeaturesGC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.

Questions about this item

Does the 3.5g syringe cover a standard CPU heat spreader?

Yes, 3.5g is enough for multiple applications on typical CPU or GPU dies.

How do I apply the paste without trapping air bubbles?

Place a small dot in the centre of the die and let the cooler pressure spread it evenly.

When should I replace the paste on a system that runs hot?

Reapply if temperatures rise noticeably after years of use; the compound is non-curing and stable from -30 to 150 °C.

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