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EN-Labs

EN-Labs 15x15mm Copper Shim Heatsink 0.5mm 10pcs

SKU CH-8F63-BATHP

Pack of ten 15×15 mm copper shims, 0.5 mm thick, rated at 401 W/mK for laptop CPU and GPU gap filling

  • CompatibilityCPU
  • MaterialCopper
  • FeaturesThis Copper Shims thermal conductivity up to 401w / mk, and
  • Dimensions15mm x 15mm x 0.5mm
  • High thermal conductivity up to 401 W/m·K for efficient heat transfer
  • 15 mm × 15 mm × 0.5 mm shim fits tight laptop component gaps
  • Copper material resists aging unlike thermal plastics that degrade over time
  • Ten shims per pack support multiple CPU, GPU, VGA and RAM chips
  • Designed for laptop BGA cooling to reduce crashes from overheating

Copper Shim Heatsink for Laptop Chips

This pack contains ten copper shims measuring 15mm by 15mm with a 0.5mm thickness. They are designed to transfer heat from BGA CPUs, GPU chips and memory ICs inside laptops. The copper material offers a thermal conductivity rating of 401 W/mK. Each shim replaces aged thermal pads that have lost effectiveness.

Check Chip Height and Clearance Before Fitting

Measure the gap between the die and the heatsink contact plate to confirm a 0.5mm shim fills the space without excessive pressure. Verify that the 15mm square footprint covers the target component without overlapping neighbouring parts. Ensure the mounting mechanism can accommodate the added rigid layer.

Fits Between Die and Cooler in Tight Stacks

The shim sits directly on the chip surface and conducts heat to the existing cooler assembly. It eliminates the need for thick thermal pads that degrade over time. The rigid copper layer maintains consistent contact pressure across the die. Ten pieces allow multiple chip coverage or spare units for future maintenance.

Highlights

  • High thermal conductivity up to 401 W/m·K for efficient heat transfer
  • 15 mm × 15 mm × 0.5 mm shim fits tight laptop component gaps
  • Copper material resists aging unlike thermal plastics that degrade over time
  • Ten shims per pack support multiple CPU, GPU, VGA and RAM chips
  • Designed for laptop BGA cooling to reduce crashes from overheating

Specifications

CompatibilityCPU
MaterialCopper
FeaturesThis Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic
at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the
Laptop will not start after overheating. And this copper heat sink solve thermal problems caused by frequent crashes laptop, etc
Package included:
10 pcs Thermal Conductive Copper Shims 15mm x 15mm x 0.6mm
Dimensions15mm x 15mm x 0.5mm

Questions about this item

What is included in the 10-piece pack and do I need thermal paste or pads separately?

The pack contains ten 15 mm × 15 mm copper shims at 0.5 mm thickness; thermal paste or pads are not included and must be purchased separately.

The listing mentions both 0.5 mm and 0.6 mm — which thickness should I choose?

The shims measure 0.5 mm thick; the 0.6 mm figure appears only in the supplier title, so use the 0.5 mm specification when planning your stack height.

What does the 401 W/m·K conductivity figure mean for my laptop GPU or CPU temperatures?

It indicates the copper shim conducts heat far better than standard copper (20–30 W/m·K), helping spread heat from BGA chips to the heatsink more efficiently.

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