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Rectangular grey phase-change thermal pad 40x80x0.2mm

Corn Electronics

Corn Electronics PTM7950 40x80x0.2mm Phase Change Thermal Pad 8.5W/mK

SKU CH-Q93A-HG7VM

A 40x80x0.2 mm phase-change pad that melts at 45 °C to deliver 8.5 W/m·K conductivity and sub-0.04 °C·cm²/W impedance for CPUs, GPUs and SSDs

Option 80x80x0.25mm

  • Phase-change material activates at 45°C for automatic gap filling
  • 5 W/m·K thermal conductivity transfers heat efficiently from CPU or GPU
  • 40 × 80 × 0.2 mm pad fits compact laptop and console heatsinks
  • Validated through 1000-hour bake at 150°C and 1000 thermal cycles
  • Low thermal impedance under 0.04 °C·cm²/W keeps temperatures stable under load

Phase-Change Pad 40x80mm

The Corn Electronics PTM7950 is a Honeywell phase-change thermal pad measuring 40 by 80 millimetres and 0.2 millimetres thick. It transitions at 45°C to fill microscopic gaps between a die and a cooler, delivering 8.5 W/m.K conductivity. The material passes 150°C baking for 1000 hours and 1000 thermal cycles while keeping impedance below 0.04°C·cm²/W.

Best for PS5, Steam Deck and Laptop GPUs

This pad suits owners of a PlayStation 5, Steam Deck or thin-and-light laptops who want a long-life alternative to traditional paste that will not pump out over time. Builders needing a thicker shim for large desktop GPU gaps or those who prefer a liquid metal interface for absolute peak conductivity should look elsewhere.

Deciding spec: 0.2 mm thickness

The single figure that determines fit is the 0.2 millimetre thickness; if your mounting pressure and stack height require a different gap filler this pad will not make proper contact.

Highlights

  • Phase-change material activates at 45°C for automatic gap filling
  • 5 W/m·K thermal conductivity transfers heat efficiently from CPU or GPU
  • 40 × 80 × 0.2 mm pad fits compact laptop and console heatsinks
  • Validated through 1000-hour bake at 150°C and 1000 thermal cycles
  • Low thermal impedance under 0.04 °C·cm²/W keeps temperatures stable under load

Specifications

No published specifications for this item yet.

Other versions of this model

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Questions about this item

What does the 8.5 W/m·K conductivity deliver once the pad is installed?

The 8.5 W/m·K rating gives a thermal impedance below 0.04 °C·cm²/W without a shim, so heat moves from the die to the cooler with very little resistance.

How does the phase-change behaviour at 45 °C affect the mounting interface?

At 45 °C the material softens and wets the microscopic gaps between die and cold-plate, eliminating air pockets that would otherwise raise contact resistance.

Will the 40 × 80 × 0.2 mm sheet cover a typical GPU or CPU die without trimming?

The 40 mm by 80 mm footprint is large enough for most desktop GPU dies and many laptop CPUs; the 0.2 mm thickness compresses slightly under mounting pressure for full coverage.

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