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Rectangular grey phase-change thermal pad, 40 by 80 millimetres, point two millimetres thick

Corn Electronics

Corn Electronics PTM7950 40x80x.2mm Phase Change Thermal Paste 8.5W/mK

SKU CH-A632-W38S5

A 40x80x.2mm PTM7950 phase-change pad melts at 45°C to deliver 8.5W/mK conductivity with under .04°Ccm²/W impedance, surviving 150°C baking and 1000 thermal cycles for lasting GPU and CPU contact

Option 40 x 40mm

  • Phase-change material activates at 45 °C for automatic gap filling
  • 5 W/m·K conductivity moves heat efficiently from CPU or GPU
  • 40 × 80 × 0.2 mm sheet fits large dies and laptop coolers
  • Passes 150 °C bake and 1000 thermal cycles for long-term reliability
  • Thermal impedance below 0.04 °C·cm²/W reduces junction temperatures

Phase Change Thermal Pad 40x80mm

The Corn Electronics PTM7950 is a phase change thermal interface material supplied as a 40 by 80 millimetre pad with a thickness of .2 millimetres. It transitions at 45°C to fill microscopic gaps between a processor or graphics die and its cooler. Rated at 8.5 W/m.K, it targets enthusiasts who want a long lasting alternative to traditional thermal paste.

Suited for GPUs CPUs and compact devices

Builders upgrading a PS5, Steam Deck, laptop or M.2 SSD will appreciate the pad format that requires no spreading and resists pump out over time. Users who prefer a liquid metal compound for absolute peak conductivity or who need a larger sheet for custom loop cold plates should look at something else.

Sustained load behaviour

The material passes 150°C baking for 1000 hours and 1000 thermal cycles while keeping thermal impedance below .04°C cm²/W without a shim. Its polymer PCM system maintains low contact resistance through repeated heating and cooling, so thermal performance stays consistent during extended gaming or compute sessions.

Highlights

  • Phase-change material activates at 45 °C for automatic gap filling
  • 5 W/m·K conductivity moves heat efficiently from CPU or GPU
  • 40 × 80 × 0.2 mm sheet fits large dies and laptop coolers
  • Passes 150 °C bake and 1000 thermal cycles for long-term reliability
  • Thermal impedance below 0.04 °C·cm²/W reduces junction temperatures

Specifications

No published specifications for this item yet.

Other versions of this model

2 more in the same range

Same family, different memory, cooler or clock — compare before you commit.

Questions about this item

Does the 40x80mm PTM7950 pad cover my GPU die and VRAM without trimming?

The pad measures 40x80x0.2mm; compare those dimensions to your die and VRAM layout before installing.

Will the 45°C phase-change temperature activate with my older cooler that runs hotter?

The material changes phase at 45°C, so it will soften and fill gaps once the component reaches that temperature.

How do I confirm the <0.04°C·cm²/W impedance is achieved after mounting?

Monitor core temperatures under sustained load; a drop to expected thermal levels indicates the pad has wetted the surfaces correctly.

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