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Small white jar containing soft grey thermal putty

COMPUTERSYSTEMS REPAIR SERVICES DATA REC

COMPUTERSYSTEMS REPAIR SERVICES DATA REC UPSIREN U6 PRO 10g thermal putty

SKU CH-WJGM-NY177

Soft, lightly tacky thermal putty that conforms to mixed component heights in thin heat-sink designs, delivering 12.8 W/m·K conductivity for GDDR6 VRAMs and power stages

Weight 10g

  • Thin heat-sink gaps filled by 12.8 W/m·K putty
  • 10 g resealable jar covers multiple laptop VRAM zones
  • Soft tacky texture stays put during reassembly
  • ~12 mm layer bridges mixed component heights cleanly
  • Non-conductive formula safe on GDDR6 memory and VRM stages

UPSIREN U6 PRO thermal putty for thin heat sinks

UPSIREN U6 PRO is a soft, lightly tacky thermal putty designed for gaming laptops and slim consoles that use low profile heat sinks. It wicks into micro gaps and holds shape under clamp pressure, helping move heat away from GDDR6 VRAMs, VRM stages and controller chips. The electrically nonconductive formula offers 12.8 W/m·K thermal conductivity. The 10 g resealable jar is pocketable for field work or bench use.

Capacity and headroom for mixed height components

The putty targets an ideal thickness around 12 mm to bridge mixed component heights where stock pads fall short or leave corners uncovered. A single 10 g jar covers several memory and VRM zones across a typical laptop mainboard. It remains stable through extended gaming sessions and productivity loads with frequent temperature swings. Builds requiring larger volumes or multiple full board repastes will need additional jars.

Thermals noise and power draw in normal use

As a passive interface material, the putty adds no noise, no power draw and no moving parts to the system. Its conformable consistency maintains contact pressure across thin heat sinks without pumping out over repeated thermal cycles. The nonconductive formulation prevents shorting risks on dense boards during assembly and long term operation. Performance scales with the cooler’s own capacity rather than the compound alone.

Highlights

  • Thin heat-sink gaps filled by 12.8 W/m·K putty
  • 10 g resealable jar covers multiple laptop VRAM zones
  • Soft tacky texture stays put during reassembly
  • ~12 mm layer bridges mixed component heights cleanly
  • Non-conductive formula safe on GDDR6 memory and VRM stages

Specifications

No published specifications for this item yet.

Other versions of this model

3 more in the same range

Same family, different memory, cooler or clock — compare before you commit.

Questions about this item

Will this putty work with the existing thin heat sink in my gaming laptop without needing a specific pad thickness?

Yes, the soft putty levels mixed component heights around 12 mm and wicks into micro gaps under clamp pressure, so it adapts to the slim heat sink already in your laptop.

How can I confirm the putty has made proper contact after I reassemble the laptop?

After reassembly, a gentle, even imprint across the GDDR6 VRAMs, VRM stages and controller chips shows the putty has spread to a uniform ~12 mm layer and is bridging every hot spot.

Does the 10 g jar include any application tools, or do I need to buy a spatula separately?

The jar contains only the 10 g of thermal putty; a plastic spatula or similar spreading tool is not included and must be sourced separately.

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