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White 100 g jar of UPSIREN U6 PRO thermal putty with plastic spatula

COMPUTERSYSTEMS REPAIR SERVICES DATA REC

COMPUTERSYSTEMS REPAIR SERVICES DATA REC UPSIREN U6 PRO 100g thermal putty 12.8 W/m·K

SKU CH-9EVW-MECPB

High-capacity 100 g jar of non-conductive thermal putty with 12.8 W/m·K conductivity, optimised for ~12 mm layers on GDDR6 VRAMs and VRM stages in thin heat-sink platforms

Weight 100 g

  • Designed for thin heat sinks with 12.8 W/m·K conductivity
  • Non-conductive putty safe for GDDR6 VRAMs and VRM stages
  • Soft tacky body stays in place during dense board assembly
  • Conforms to ~12 mm gaps where standard pads fall short
  • 100 g jar with spatula supplies long multi-device projects

High-capacity thermal putty for thin heatsinks

UPSIREN U6 PRO is a 100 g jar of non-conductive thermal putty rated at 12.8 W/m·K. It is formulated for compact cooling assemblies where a soft, lightly tacky compound can conform to micro-gaps and resist slump during assembly. The material targets heat-dense areas such as GDDR6 VRAMs, VRM stages and controller chips in thin form-factor devices. Supplied with a spatula and protective films, it is produced in the European Union.

Suited for labs and technicians servicing compact

This putty serves professionals and advanced users who maintain gaming laptops or other space-constrained platforms requiring a ~12 mm total interface thickness. It decants cleanly for repeated use across multiple devices, preserving consistency on long projects. Buyers needing a traditional grease for standard CPU IHS applications or a pre-cut pad for uniform gap-filling should consider alternative product types.

12.8 W/m·K conductivity at ~12 mm thickness

The single specification that decides fit is the combination of 12.8 W/m·K thermal conductivity and the designed ~12 mm operating thickness. This defines the putty's ability to bridge mixed component heights on dense boards where thinner pastes or stiffer pads cannot maintain contact. Verify that your target assembly matches this thickness requirement before purchase.

Highlights

  • Designed for thin heat sinks with 12.8 W/m·K conductivity
  • Non-conductive putty safe for GDDR6 VRAMs and VRM stages
  • Soft tacky body stays in place during dense board assembly
  • Conforms to ~12 mm gaps where standard pads fall short
  • 100 g jar with spatula supplies long multi-device projects

Specifications

No published specifications for this item yet.

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Questions about this item

Does the 12.8 W/m·K putty stay stable and non-conductive when the laptop runs hot all day?

Yes, the compound is rated at 12.8 W/m·K and is electrically non-conductive, designed to withstand frequent thermal cycling in compact systems without slumping or degrading.

What tools or surfaces do I need before applying this putty to GDDR6 VRAMs and VRM stages?

The jar includes a plastic spatula; you only need a clean component surface and the thin heat sink — no extra pads, adhesives or specialised equipment are required.

Will this 100 g jar work on older GPUs that have taller memory chips and uneven gaps?

The putty is optimised for a ~12 mm total thickness and conforms to mixed heights, so it can bridge larger gaps that standard pads leave, but it is formulated for thin heat-sink platforms.

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