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ASRock Rack

ASRock Rack 1U10E-ICX2 barebone server, dual Socket P+, 10×2.5″ NVMe bays

SKU CH-SEJY-Z2ECW MPN 1U10E-ICX2

1U rackmount barebone with dual Socket P+ for 3rd Gen Intel Xeon processors, 32 DDR4 slots, 10 hot-swap 2.5″ NVMe bays, two PCIe 4.0 x16 slots and OCP NIC 3.0

  • Form Factor1U Rackmount
  • WorkloadGeneral Purpose Server
  • CPU TypeSupports 3rd Gen Intel Xeon Scalable processors
  • CPU SocketSocket P+
  • Installed CPUNo CPU Installed
  • Max Processors2
  • Supports dual 3rd Gen Intel Xeon Scalable processors for high compute density
  • 10 hot-swap 2.5" NVMe bays deliver massive all-flash storage capacity
  • 32 DDR4 slots enable up to 8TB memory for memory-intensive workloads
  • Dual FHHL PCIe4.0 x16 slots plus OCP NIC 3.0 provide flexible I/O expansion
  • 1U form factor with redundant 1600W CRPS power supplies optimises rack space

Dual-Socket P+ Barebone for 3rd Gen Xeon

This 1U rackmount barebone accepts up to two 3rd Gen Intel Xeon Scalable processors in Socket P+ (LGA 4189). The Intel C621A chipset provides the platform foundation. It targets integrators building dense compute nodes who will supply their own CPUs, memory and storage.

Ten Hot-Swap NVMe Bays Plus M.2 and OCP

Ten front-access 2.5-inch bays connect each drive through a PCIe 4.0 x4 link for NVMe U.3/U.2 devices. A single M-key M.2 slot (2280/2260/2242) adds PCIe 3.0 x4 or SATA 6Gb/s boot or cache capacity. One OCP NIC 3.0 slot (PCIe 4.0 x16) enables flexible high-speed networking.

Redundant 1600W CRPS and Full-Height PCIe 4.0 Slots

A 1+1 1600W CRPS power supply delivers redundancy in a 1U depth. Two full-height half-length PCIe 4.0 x16 slots (one per CPU) accommodate accelerators or additional I/O. Front panel provides power and reset buttons, power and drive LEDs, and two USB 3.2 Gen 1 Type-A ports. Remote management via IPMI is included.

Highlights

  • Supports dual 3rd Gen Intel Xeon Scalable processors for high compute density
  • 10 hot-swap 2.5" NVMe bays deliver massive all-flash storage capacity
  • 32 DDR4 slots enable up to 8TB memory for memory-intensive workloads
  • Dual FHHL PCIe4.0 x16 slots plus OCP NIC 3.0 provide flexible I/O expansion
  • 1U form factor with redundant 1600W CRPS power supplies optimises rack space

Specifications

BrandASRock Rack
Model1U10E-ICX2
Form Factor1U Rackmount
WorkloadGeneral Purpose Server
CPU TypeSupports 3rd Gen Intel Xeon Scalable processors
CPU SocketSocket P+
Installed CPUNo CPU Installed
Max Processors2
North BridgeIntel C621A
Memory Slots32 x 288Pin
Installed Memory SizeNo Memory Installed
Max Memory SupportedMax. Capacity per DIMM
- RDIMM: up to 64GB
- RDIMM-3DS: up to 256GB
- LRDIMM: up to 128GB
- LRDIMM-3DS: up to 256GB
RegisteredYes
Installed HDDNo Storage Installed
M.21 M-key (PCIe3.0 x4 or SATA 6Gb/s), supports 2280/2260/2242 form factor [PCH]
PCI ExpressPCIe x 16
Rear: 2 FHHL PCIe4.0 x16 [CPU1] [CPU2]
OCP slot
1 OCP NIC 3.0 (PCIe4.0 x16) [CPU1]
Hot-Swap Bays10 x hot-swap 2.5" NVMe (PCIe4.0 x4) drive bays
ButtonsPower, Reset
LEDsPower, HDD
Front USB2 x USB 3.2 Gen 1 Type-A
COM1
VGA1
Rear USB2 x USB 3.2 Gen 1 Type-A
RJ451 dedicated IPMI
Max. Power1+1 CRPS, 1600W, 100-240V, 47-63Hz
BIOS FeaturesBIOS Type: 256Mb SPI Flash ROM
BIOS Features: AMI UEFI BIOS
Fans8 PWM hot-swap 40 x 56 mm fans
Hardware MonitorTemperature: CPU, PCH, MB, Card side Temperature Sensing
Fan: CPU/Rear/Front Fan Tachometer
CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjust by CPU Temperature)
CPU/Rear/Front Fan Multi-Speed Control
Voltage: CPU1_PVCCIN, CPU2_PVCCIN, PVDDQ_ABCD,PVDDQ_EFGH,PVDDQ_IJKL,PVDDQ_MNOP, 1.05V_PCH,1.8V_PCH, +BAT,PVNN_PCH, 3.3V,5V,12V,3.3VSB, 5VSB
TemperatureOperation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
HumidityNon operation humidity: 20% ~ 90% ( Non condensing)
Dimensions2" x 31" x 17"
Shipping weight25.31 kg
Package size1130 × 622 × 267 mm

Questions about this item

How often will the 1+1 1600W CRPS redundant power supplies need replacement in this 1U server?

The 1+1 1600W CRPS units are hot-swappable; if one fails the other maintains power while you replace the module, so no scheduled replacement is required.

Which component reaches its thermal or power ceiling first when all 10 NVMe bays and both CPUs run continuously?

The 10 hot-swap 2.5″ NVMe bays (PCIe4.0 x4 each) and dual Socket P+ CPUs share the 1U airflow path; sustained heavy I/O and CPU load will hit the chassis thermal limit before any single drive or processor throttles.

What noise and heat levels should I expect from the 1U10E-ICX2 running 24/7 with dual CPUs and 10 NVMe drives?

Dual 1600W CRPS fans and internal system fans spin faster under full load, producing noticeable rack-level noise and exhaust heat that requires adequate cabinet cooling.

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