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Zalman

Zalman ZM-STC9 thermal paste 4 g 9.1 W/m·K

SKU CH-JM3F-4Q4XE MPN ZM-STC9

High-conductivity 9.1 W/m·K thermal compound in a 4 g syringe with graduation marks and a rubber cap for reuse

  • High thermal conductivity of 9.1 W/m·K for efficient heat transfer
  • Non-electrically conductive formula prevents short-circuit risk on CPU or GPU
  • Syringe with measuring graduations enables precise application and reuse
  • Rubber cap stops paste hardening during storage between uses
  • RoHS-compliant materials contain silicone oil, alumina, aluminium and zinc oxide

Premium thermal grease for CPU and GPU

Zalman ZM-STC9 is a 4 g syringe of gray thermal compound rated at 9.1 W/m·K. It targets builders and upgraders who need reliable heat transfer between a processor die and a cooler base without electrical conductivity risk.

Syringe with graduations and rubber cap

The plunger barrel carries printed scale markings so you can dispense an exact amount and see how much remains. A fitted rubber cap seals the nozzle between uses, preventing the 250 Pa·s viscosity paste from hardening inside the tip.

Check cooler mounting pressure and surface flatness

Uneven pressure or a warped base will leave microscopic gaps that no paste can fill, reducing the effective conductivity below the rated 9.1 W/m·K. Verify that your retention mechanism applies uniform force across the entire die area before applying compound.

Highlights

  • High thermal conductivity of 9.1 W/m·K for efficient heat transfer
  • Non-electrically conductive formula prevents short-circuit risk on CPU or GPU
  • Syringe with measuring graduations enables precise application and reuse
  • Rubber cap stops paste hardening during storage between uses
  • RoHS-compliant materials contain silicone oil, alumina, aluminium and zinc oxide

Specifications

No published specifications for this item yet.

Questions about this item

How can I verify the ZM-STC9 is performing correctly after applying it to my CPU?

Monitor your processor temperatures under load using hardware monitoring software; the 9.1 W/m·K thermal conductivity and 250 Pa.s viscosity should deliver stable, lower temperatures compared to stock paste.

What comes in the package and is anything else required for installation?

The box contains a 4 g syringe with measuring graduations and a rubber cap for storage; no additional tools or materials are needed for application on CPU or GPU.

Which Zalman thermal compound version should I choose for the highest conductivity?

Select the ZM-STC9 model; at 9.1 W/m·K it exceeds the STC8 at 8.3 W/m·K and the STC7 at 7.2 W/m·K.

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