Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Wadermoon
Carbon-based thermal compound rated at 13.8 W/mK, non-conductive, supplied in a 2.0 g syringe with applicator for CPU and GPU heat dissipation
Wadermoon Thermalright TF8 is a 2.0g syringe of carbon-based thermal compound rated at 13.8 W/mK. The grey paste is non-electrically conductive and metal-free, so it poses no short-circuit risk if it contacts pins. It is designed for CPU and GPU interfaces on any cooler type. The supplier states durability of at least eight years without re-application.
The compound operates from -250 °C to 380 °C, with long-term use specified up to 300 °C. Thermal resistance is quoted below 0.01 cm²·K/W and density is 2.9 g/cm³. Because it contains no metallic particles, it remains safe on exposed electrical traces. The 2.0g volume covers multiple standard desktop sockets but may be insufficient for large server heat-spreaders or repeated reapplications.
This single figure determines whether the paste meets a builder's thermal budget. At 13.8 W/mK it exceeds many mainstream compounds such as the referenced 8.5 W/mK alternative, making it suitable for overclocking and sustained high loads. Buyers who need lower thermal resistance for extreme sub-ambient cooling should verify the rating against their target delta-T.
| Brand | Thermalright |
|---|---|
| Series | TF8 2g |
| Model | Thermal Paste |
| Volume / Net Weight | 2.0g |
| Thermal Conductivity | 13.8 W/mk |
| Long Term Operating Temperature | -250~380°C |
| Specifications | Operating temperature:-250~300°C Electrical conductivity:NO Harmless:YES Content: 2g |
| Features | Convenient 2.0 gram syringe, making this thermal paste very easy to apply Designed with extremely demanding applications Popular choice for overclockers and extreme gamers |
The product is supplied only as a 2.0 g syringe, so no larger capacity is offered for this model.
It indicates very high thermal conductivity that moves heat from the CPU or GPU to the cooler quickly, making it suitable for overclocking and demanding workloads.
The compound contains no metal particles and is non-electrically conductive, so it will not cause short circuits if it contacts pins or surrounding components.
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