UPSIREN PCM-1 Thermal Paste Pad 80x40x0.25mm

Phase-change silicone pad for CPUs and GPUs

UPSIREN PCM-1 is a 0.25 mm thick phase-change thermal interface sheet sized at 80 by 40 mm. It replaces traditional grease with a solid pad that softens above 45 degrees Celsius to fill microscopic gaps. The material stays in place once it re-solidifies below that temperature, preventing pump-out around the die edges. It is aimed at enthusiasts repasting processors or graphics cards who want a cleaner, long-lasting application.

Upgrade from liquid paste that pumps out over time

Conventional silicone grease tends to migrate away from the heat source after repeated thermal cycles, leaving uneven coverage and dried-out centres. This pad eliminates that creep because it returns to a solid state when the component cools below 45 degrees. The manufacturer rates the service life at two to three times that of ordinary grease, making the switch worthwhile for builds that run hot continuously or sit in hard-to-reach loops. Installation is a simple cut-to-size and peel process with no curing wait.

Thin 0.25 mm layer suited to flat, mating surfaces

The pad delivers a tested thermal impedance below 0.04 C cm squared per watt after reliability validation at 150 degrees for 1000 hours and 1000 thermal cycles. It performs best between flat copper or nickel-plated cold plates and bare die or integrated heat spreaders with minimal warpage. Because the material only exists in this single thickness, it cannot bridge large gaps or compensate for bowed coolers; users with uneven mounting pressure or stepped packages should look for a thicker compressible pad instead.