Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Unique-Bargains
Blue silicone thermal pad measuring 100 × 100 × 1 mm with 1.5 W/m-K conductivity for bridging gaps between heatsinks and components
This 100 mm by 100 mm by 1 mm silicone pad sits between a heatsink and a component to fill uneven surfaces and improve thermal transfer. The material has a thermal conductivity of 1.5 W/m-K and withstands temperatures from 50 to 200 degrees Celsius. Its low hardness provides damping and cushioning while maintaining good compressibility. A protective film is removed before placement.
Builders who need a thin, blue pad for memory modules, VRM areas or small GPU chips will find the 1 mm thickness easy to trim and position. The 100 mm square yields several pieces for multiple applications. Users requiring higher thermal conductivity for large CPUs or high-power GPUs should look at thicker or more conductive alternatives. The single-sheet pack may not cover larger heatsink bases.
At this conductivity the pad comfortably moves heat from low-power ICs, voltage regulators and memory chips within the 50 to 200 degree operating window. The 1 mm thickness limits the heat volume it can bridge, so sustained high-wattage components will see diminishing returns. Cutting the sheet to size gives flexibility but does not increase the inherent conductivity ceiling.
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The pad is 1 mm thick and 100 mm by 100 mm, so it bridges gaps up to 1 mm across a 100 mm square surface.
Yes, the pad withstands 50 to 200 °C and maintains its 1.5 W/m-K conductivity throughout that range.
Check that the protective film is removed and the pad sits flat with no air bubbles; even compression across the heatsink indicates good thermal transfer.
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