Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Set of 20 copper heatsinks measuring 15 mm square by 1.8 mm thick for chipset, RAM or small IC cooling
This set includes 20 copper heatsinks measuring 15 by 15 millimetres and 1.8 millimetres thick. They are intended for DIY cooling of small ICs such as chipset components, memory modules, GPU chips or CPU voltage regulators. The pack suits hobbyists who need multiple identical pads for a single project or for spares.
Each pad relies on direct metal-to-die contact and has no pre-applied thermal interface material. You must supply your own thermal tape, adhesive or paste to achieve reliable heat transfer. Without a bonding layer the copper will not stay in place or conduct heat effectively.
The pads are bare copper with a copper-tone finish and can be cut to custom shapes using a hacksaw and file. The supplier recommends cleaning the surfaces with alcohol and a microfibre cloth before installation. No mounting hardware or adhesive is included in the package.
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These pads measure 15 x 15 mm with a 1.8 mm thickness, so they suit small ICs such as MOSFETs or memory chips; choose a larger heatsink only if the component footprint exceeds 15 mm.
The 1.8 mm copper pad spreads heat from the chip into its 15 x 15 mm surface area; actual temperature reduction depends on the chip's power draw and the airflow inside your case.
The pads ship without thermal tape or adhesive; you must supply your own thermal pad, paste, or adhesive to create a reliable thermal path between the copper and the die.
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